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For module hardware, details have a look at: Trizeps VII.
OS-Images for Windows Embedded Compact 7 or Windows Embedded Compact 2013 can be built using the BSP for Trizeps VII.
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Windows Embedded Compact 2013
Built | Description | Download | ||
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28.11.2018 |
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12.01.2018 |
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04.01.2018 | Eval-Board-Image for iPAN7LCE (capacitive or resistive touch) | eval_tr7ce8_ipan7lc_20180104.zip, |
Windows Embedded Compact 7
Built | Description | Download |
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19.04.2016 | Eval-Board-Image for iPAN7FF (capacitive or resistive touch) (FlexCAN) | |
06.04.2016 | Eval-Board-Image for iPAN7FF (capacitive or resistive touch) (SJA1000) | |
16.02.2016 | Eval-Board-Image for iPAN7LCE (capacitive or resistive touch) | |
16.02.2016 | Eval-Board-Image for iPAN7FF (capacitive or resistive touch) | |
11.10.2015 | Eval-Board-Image for iPAN7 (capacitive or resistive touch) | |
11.10.2015 | Eval-Board-Image for iPAN7 (capacitive or resistive touch) | |
03.07.2014 | Eval-Board-Image for iPAN7 with capacitive touch | |
03.07.2014 | Eval-Board-Image for iPAN7 with resistive touch | |
07.03.2014 | Eval-Board-Image for iPAN7 with capacitive touch | |
27.03.2014 | Eval-Board-Image for iPAN7 with resistive touch. USB-OTG configured as slave (Hardware patch necessary) | |
05.02.2014 | Eval-Board-Image for iPAN7 with capacitive touch | |
05.02.2014 | Eval-Board-Image for iPAN7 with resistive touch |