For module hardware details have a look at: Trizeps VII.
OS-Images for Windows Embedded Compact 7 or Windows Embedded Compact 2013 can be built using the BSP for Trizeps VII.
OS-Images and Tool-Chains for Linux and Android can be found at: Linux (Android,Debian,U-Boot,...).
Please do not hesitate to contact Seco to ask for other supported Operating Systems.
Windows Embedded Compact 2013
08.03.2018 | Eval-Board-Image for iPAN5 (capacitive or resistive touch) |
Windows Embedded Compact 7
Built | Description | Download |
|---|---|---|
16.02.2016 | Eval-Board-Image for iPAN5 (capacitive or resistive touch) | |
11.10.2015 | Eval-Board-Image for iPAN5 (capacitive or resistive touch) | |
02.09.2014 | Eval-Board-Image for iPAN5 with resistive touch | |
03.07.2014 | Eval-Board-Image for iPAN5 with capacitive touch | |
05.02.2014 | Eval-Board-Image for iPAN5 with capacitive touch | |
05.02.2014 | Eval-Board-Image for iPAN5 with resistive touch | |
09.01.2014 | Eval-Board-Image for iPAN5 with resistive touch | |
08.11.2013 | Eval-Board-Image for iPAN5 with capacitive multitouch. Includes RS485-support | |
27.09.2013 | Eval-Board-Image for iPAN5 with capacitive touch. Includes RS485-support | |
12.09.2013 | Eval-Board-Image for iPAN5 with capacitive touch | |
18.12.2013 | Eval-Board-Image for iPAN5 with resistive touch |