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Description

The Maury is powered by NXP i.MX 93 processor, which is designed to meet the latest market requirements of connected streaming audio/video devices, scanning/imaging devices and various devices demanding high-performance and low-power.

The i.MX 93 family of processors features advanced implementation of a dual ARM® Cortex®-A55 core, which operates at speeds of up to 1.7GHz (consumer version) and 1.5GHz (industrial version) integrated with a NPU that accelerates machine learning inference. A general purpose Cortex®-M33 core processor is for real-time and low-power processing. A 32-bit LPDDR4 is used for memory. There are a number of other i.MX 93 interfaces for connecting peripherals, such as displays, cameras, GPS and sensors, which are extended by components already available on the module:

  • eMMC (up to 64 GByte)

  • 2x 1Gbit Ethernet

  • TPM

  • USB 2.0 Hub (4x)

  • eDP

  • RTC

  • EEPROM

  • WLAN 802.11 a/b/g/n/ac and Bluetooth 5.3 Combo module (M.2 1216)

SMARC Standard

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
The Module power envelope is typically under 6W although designs up to about 15W are possible.

Block Diagram

Features and Interfaces

Features

Processor:

NXP i.MX 93 ARM® Dual Cortex-A55 @ 1.7GHz (consumer), 1.5GHz (industrial)

NXP i.MX 93 ARM® Cortex-M33 @ 250MHz

NXP i.MX 93 ARM® EthosTM U-65 microNPU

Memory:

Up to 2GByte of 16-bit LPDDR4-4000

Storage:

Up to 64 GByte eMMC

Wireless:

WLAN 802.11 a/b/g/n/ac

Bluetooth 5.3

MicroRF-antenna connector

Power:

PMIC to generate all internal and external voltages from 3.3V up to 5V supply.

Dimensions:

(Length x Width x Height): 82.0 x 50.0 x 5.4 mm

Interfaces / Signals accessible over connector:

  • Power Supply through 5.0VDC +- 5%, +3.2V_RTC

  • LVDS single channel up to 720p60

  • MIPI_DSI or eDP interface (factory alternatives) up to 1080p60

  • SD 4-bit interface (boot device)

  • 2x Gigabit Ethernet interfaces

  • 1x USB 2.0 OTG port

  • up to 4x USB 2.0 using optional internal 2.0 Hub

  • 1x I2S port

  • 2x UART (4-wires)

  • 2x UART (2-wires)

  • 2x CAN interfaces

  • 12x GPIOs

  • 1x MIPI_CSI 2 Lanes Camera interface

  • 1x General Purpose I2C Bus

  • 2x PWM ports

  • TPM

Technical Documents

1 Pin-description

The main connector of the Maury is the SMARC connector.

J400 may be used for debugging, programming and testing.

On the top side are UFL antenna connectors for the on-board WLAN + Bluetooth chip.

here: picture top side here: picture bottom side

Figure: Connectors

1.1 Pin Description (Primary function)

The i.MX 93 processor is a highly configurable device, where each pin may have multiple different functions. Please view chapter “1.2 Pin-Mux Information” for details on how these pins may be configured by software.

J1600: SMARC connector:

J400: i.MX 93 JTAG connector:

This flex-cable connector uses the Seco JTAG connector standard.

1.2 Pin-Mux information

Several pins are GPIOs which may be configured for different functions by software. Please check with the processor datasheet for additional pin-mux information.

1.2.1 i.MX 93 pins

The i.MX 93 pins got different functions. Only the more common used are listed.

add table!!!

1.3 Electrical pin information

PI:

Power Input

DO:

Digital Output

PO:

Power Output

DIO:

Digital Input/Output

DDI:

Differential Input

AI:

Analog Input

DDO:

Differential Output

AO:

Analog Output

DDIO:

Differential Input/Output

DI:

Digital Input

OD

Open-Drain Output

PD:

Pull-Down

(PDp: Pull-Down, Pull-behavior can be changed by software)

PU:

Pull-Up

PUp: Pull-Up, Pull-behavior can be changed by software

If two “types” are specified, the first value determines the type of primary function.

2. Interfaces

This chapter includes a short description of all interfaces of the Maury. Please consult the processor datasheet for detailed information.

2.1 Power Supply

The Maury can be supplied by a single +5.0V power supply.

Name

Description

5V_SLEEP

5V power input. This supply controls the STM32. STM32 MCU controls reset and power to the i.MX 93 processor.

GND

Ground input

VDD_RTC

3V power supply to supply the RTC on the Maury

2.2 Control signals

Name

Description

RESET_IN#

Negated reset input. 0: reset device, 1: normal operation

RESET_OUT#

Negated reset output. 0: device in reset, 1: normal operation (active low)

BOOT_SEL[2…0]

tell the module what physical device to do a BCT boot from (see table xxx below)

STM32_RST#

Negated reset input for STM32. 0: reset STM32, 1: normal operation (active low)

POWER_BTN#

Carrier based power button (active low)

WDT_TIME_OUT#

Watchdog output (active low)

LID#

Lid open/close indication input (active low)

SLEEP#

Sleep indicator input (active low)

VIN_PWR_BAD#

Power status input. 0: Carrierrboard power is not ready to support Maury, 1: Carrierboard power is ready to support Maury (active low)

CHARGING#

Input, held low by carrier during battery scharging, float when charging is complete (active low)

CHARGER_PRSNT#

Input, held low by Carrier if DC input for battery charger is present (active low)

CARRIER_STBY#

Power status output. If the power save state standby
mode is implemented at the Carrier the runtime voltage rails are enabled with this control signal from the module. The module drives this signal high to enable runtime power rails. If no separate standby mode is implemented all rails are enabled with CARRIER_PWR_ON signal. This signal is driven high by the module at runtime. (active low)

CARRIER_PWR_ON

Power status output. It is a signal to Carrier that the
Carrier specific power supplies that shall be powered during standby may be enabled. If standby power save state is implemented at the Carrier this signal enables the standby voltage rails.

FORCE_RECOV#

Primary boot media can be re-initialized (active low)

BATLOW#

Input, battery low indication to Module. Carrier to float the line in inactive state (active low)

TEST#

Negated test input of STM32. 0: device in programming mode, 1: normal operation (active low)

Table xxx: Boot select pins

BOOT_SEL2#

BOOT_SEL1#

BOOT_SEL0#

Boot Source

0

GND

GND

GND

Carrier SATA

1

GND

GND

Float

Carrier SD Card

2

GND

Float

GND

Carrier eSPI

3

GND

Float

Float

Carrier SPI

4

Float

GND

GND

Module device (NAND, NOR)

5

Float

GND

Float

Remote boot (GBE, serial)

6

Float

Float

GND

Module eMMC Flash

7

Float

Float

Float

Module SPI

2.3 UART

The i.MX 93 provides 4 Universal Asynchronous Receiver/Transmitter. With a transceiver these signals can be converted to RS232, RS485 or IrDA.

Following UART ports are accessible through the SMARC connector:

Name

Description

SER0_TX

Serial 0 transmit output

SER0_RX

Serial 0 receive input

SER0_RTS#

Serial 0 request to send output (active low)

SER0_CTS#

Serial 0 clear to send input (active low)

SER1_TX

Serial 1 transmit output

SER1_RX

Serial 1 receive input

SER2_TX

Serial 2 transmit output

SER2_RX

Serial 2 receive input

SER2_RTS#

Serial 2 request to send output (active low)

SER2_CTS#

Serial 2 clear to send input (active low)

SER3_TX

Serial 3 transmit output

SER3_RX

Serial 3 receive input

Baudrate: High-speed TIA/EIA-232-F compatible, up to 1Mbit/s, IrDA-compatible, up to 115.2 Kbit/s

Data-Bits: 7 or 8 bits (RS232) or 9 bit (RS485)

Stop Bits: 1, 2

Parity: None, Even, Odd

Features: Hardware flow control (RTS, CTS)

2.4 SPI

The serial peripheral interface is a programmable synchronous serial port, which may be used to connect to a multiple of different peripherals.

Name

Description

SPIO_CS0#

SPI 0 slave select

SPI0_CK

SPI 0 clock

SPI0_DIN

SPI 0 data in

SPI0_DO

SPI 0 data out

Speed: up to xxx MHz

2.5 I2C

The Inter-Integrated Circuit (I2C ) provides functionality of a standard I2C master and slave.

Name

Description

I2C1_SCL

I2C1 clock

I2C1_SDA

I2C1 data

I2C3_SCL

I2C3 clock

I2C3_SDA

I2C3 data

I2C_PM_CK

I2C PM clock

I2C_PM_DAT

I2C PM data

Speed: Standard mode, up to 100kbit/s
Fast mode, up to 400 kbit/s

Features: Multimaster operation.
I2C Bus specification version 2.1

2.6 I2S

The Inter-IC sound interface provides a synchronous audio interface (SAI) and is used to connect to audio codecs.

Name

Description

I2S0_LRCK

I2S0 Left & Right Synchronisation Clock

I2S0_SDOUT

I2S0 Digital Audio Output

I2S0_SDIN

I2S0 Digital Audio Input

I2S0_CK

I2S0 Digital Audio Clock

I2S2_LRCK

I2S2 Left & Right Synchronisation Clock

I2S2_SDOUT

I2S2 Digital Audio Output

I2S2_SDIN

I2S2 Digital Audio Input

I2S2_CK

I2S2 Digital Audio Clock

2.7 SD-Card

The SD-Card interface may be used to connect a SD-Card, eMMC or SDIO hardware.

Name

Description

SDIO_CMD

SDIO command output

SDIO_CD#

SDIO card detect input (active low)

SDIO_CK

SDIO clk output

SDIO_PWR_EN_3V3

SDIO Power enable signal

SDIO_D0

SDIO data bit 0

SDIO_D1

SDIO data bit 1

SDIO_D2

SDIO data bit 2

SDIO_D3

SDIO data bit 3

Speed: Card bus clock frequency up to 208 MHz

Features: Conforms to the SD Host Controller Standard Specification version 3.0.

Compatible with the MMC System Specification version 4.2/4.3/4.4/4.41/5.0.
Compatible with the SD Memory Card Specification version 3.0 and supports the Extended Capacity SD Memory Card
Compatible with the SDIO Card Specification version 3.0

2.8 USB

In the standard configuration, the Maury offers two USB 2.0 ports, which are routed to the SMARC connector. As an assembly option, a quad USB hub is possible, so that up to five USB ports are possible on the SMARC connector.

Name

Description

USB0_DP

USB0 data (positive)

USB0_DN

USB0 data (negative)

USB0_EN_OC#

USB0 power enable output and overcurrent input (active low)

USB0_VBUS_DET

USB0 VBUS detection

USB0_OTG_ID

USB0 ID detect

USB1_EXT_DP

USB1 data (positive)

USB1_EXT_DN

USB1 data (negative)

USB1_EN_OC#

USB1 power enable output and overcurrent input (active low)

USB2_DP

USB2 data (positive) (optional)

USB2_DN

USB2 data (negative) (optional)

USB2_EN_OC#

USB2 power enable output and overcurrent input (active low) (optional)

USB3_DP

USB3 data (positive) (optional)

USB3_DN

USB3 data (negative) (optional)

USB3_EN_OC#

USB3 power enable output and overcurrent input (active low) (optional)

USB4_DP

USB4 data (positive) (optional)

USB4_DN

USB4 data (negative) (optional)

USB4_EN_OC#

USB4 power enable output and overcurrent input (active low) (optional)

Speed: High-speed 480Mbit/s
Full-speed 12Mbit/s
Low-speed 1.5Mbit/s
Features: Complies with USB specification rev. 2.0

2.9 Ethernet

The Maury uses two Realtek RTL8211 integrated 10/100/1000 Mbps Ethernet Transceiver to interface with the i.MX 93 RGMII.

Name

Description

GBE0_MDI0_P

ETH port 0 differential pair 0 positive signal

GBE0_MDI0_N

ETH port 0 differential pair 0 negative signal

GBE0_MDI1_P

ETH port 0 differential pair 1 positive signal

GBE0_MDI1_N

ETH port 0 differential pair 1 negative signal

GBE0_MDI2_P

ETH port 0 differential pair 2 positive signal

GBE0_MDI2_N

ETH port 0 differential pair 2 negative signal

GBE0_MDI3_P

ETH port 0 differential pair 3 positive signal

GBE0_MDI3_N

ETH port 0 differential pair 3 negative signal

GBE0_LINK100#

ETH port 0 Link Speed indication LED for GBE0 100Mbps (active low)

GBE0_LINK1000#

ETH port 0 Link Speed indication LED for GBE0 1000Mbps (active low)

GBE0_LINK_ACT#

ETH port 0 Link / Activity Indication LED driven Low on Link (10, 100 or 1000Mbps) Blinks on Activity (active low)

GBE1_MDI0_P

ETH port 1 differential pair 0 positive signal

GBE1_MDI0_N

ETH port 1 differential pair 0 negative signal

GBE1_MDI1_P

ETH port 1 differential pair 1 positive signal

GBE1_MDI1_N

ETH port 1 differential pair 1 negative signal

GBE1_MDI2_P

ETH port 1 differential pair 2 positive signal

GBE1_MDI2_N

ETH port 1 differential pair 2 negative signal

GBE1_MDI3_P

ETH port 1 differential pair 3 positive signal

GBE1_MDI3_N

ETH port 1 differential pair 3 negative signal

GBE1_LINK100#

ETH port 1 Link Speed indication LED for GBE0 100Mbps (active low)

GBE1_LINK1000#

ETH port 1 Link Speed indication LED for GBE0 1000Mbps (active low)

GBE1_LINK_ACT#

ETH port 1 Link / Activity Indication LED driven Low on Link (10, 100 or 1000Mbps) Blinks on Activity (active low)

2.10 CAN

The CAN interface of the Maury supports 2x CAN FD.

Name

Description

CAN0_TX

CAN 0 transmit data

CAN0_RX

CAN 0 receive data

CAN1_TX

CAN 1 transmit data

CAN1_RX

CAN 1 receive data

2.11 Display

2.11.1 LVDS-display

Name

Description

LVDS0_TX0_P

LVDS port differential pair 0 positive signal

LVDS0_TX0_N

LVDS port differential pair 0 negative signal

LVDS0_TX1_P

LVDS port differential pair 1 positive signal

LVDS0_TX1_N

LVDS port differential pair 1 negative signal

LVDS0_TX2_P

LVDS port differential pair 2 positive signal

LVDS0_TX2_N

LVDS port differential pair 2 negative signal

LVDS0_TX3_P

LVDS port differential pair 3 positive signal

LVDS0_TX3_N

LVDS port differential pair 3 negative signal

LVDS0_CK_P

LVDS port differential clock pair positive signal

LVDS0_CK_N

LVDS port differential clock pair negative signal

LCD0_BKLT_EN

Backlight enable signal

LCD0_BKLT_PWM

Backlight PWM signal

LCD0_VDD_EN

Power control signal

2.11.2 MIPI or eDP (optional)

Name

Description

EDP_DSI_D0_P

MIPI port differential pair 0 positive signal
EDP port differential pair 0 positive signal (optional)

EDP_DSI_D0_N

MIPI port differential pair 0 negative signal
EDP port differential pair 0 negative signal (optional)

EDP_DSI_D1_P

MIPI port differential pair 1 positive signal
EDP port differential pair 1 positive signal (optional)

EDP_DSI_D1_N

MIPI port differential pair 1 negative signal
EDP port differential pair 1 negative signal (optional)

EDP_DSI_D2_P

MIPI port differential pair 2 positive signal
EDP port differential pair 2 positive signal (optional)

EDP_DSI_D2_N

MIPI port differential pair 2 negative signal
EDP port differential pair 2 negative signal (optional)

EDP_DSI_D3_P

MIPI port differential pair 3 positive signal
EDP port differential pair 3 positive signal (optional)

EDP_DSI_D3_N

MIPI port differential pair 3 negative signal
EDP port differential pair 3 negative signal (optional)

EDP_DSI_CLK_P

MIPI port differential clock pair positive signal
EDP port differential clock pair positive signal (optional)

EDP_DSI_CLK_N

MIPI port differential clock pair negative signal
EDP port differential clock pair negative signal (optional)

LCD1_BKLT_EN

Backlight enable signal

LCD1_BKLT_PWM

Backlight PWM signal

LCD1_VDD_EN

Power control signal

2.12 Camera

The i.MX 93 processor got a MIPI CSI camera interface. It is connected to the SMARC connector.

Name

Description

CSIO_CK_P

CSI port differential clock pair positive signal

CSIO_CK_N

CSI port differential clock pair negative signal

CSIO_RX0_P

CSI port differential pair 0 positive signal

CSIO_RX0_N

CSI port differential pair 0 negative signal

CSIO_RX1_P

CSI port differential pair 1 positive signal

CSIO_RX1_N

CSI port differential pair 1 negative signal

GPIO0/CAM0_PWR#

Camera 0 power enable signal (active low)

GPIO1/CAM1_PWR#

Camera 1 power enable signal (active low)

GPIO2/CAM0_RST#

Camera 0 reset signal (active low)

GPIO3/CAM1_RST#

Camera 1 reset signal (active low)

Speed:

Features

2.13 Wireless

The Maury may be equipped with a AzureWave CM276NF WiFi and BT module. The antennas are connected directly to the module.

3. Specifications

3.1 Absolute Maximum Ratings

Absolute maximum ratings reflect conditions that the module may be exposed outside of the operating limits, without experiencing immediate functional failure. Functional operation is only expected during the conditions indicated under “Recommended Operating Conditions”. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the module. Exposure to absolute -maximum rated conditions for extended periods may affect device reliability.

Pin

Min

Max

Unit

Supply Voltage

5V_SLEEP

-0.3

5.5

V

VDD_RTC

-0.3

3.5

V

Storage Temperature

TStorage

-40

+85

°C

3.2 Recommended Operating Conditions

Pin

Min

Typ

Max

Unit

Supply Voltage

5V_SLEEP

4.75

5.0

5.25

V

VDD_RTC

2.0

3.0

3.25

V

Supply current (typ.)
Power consumption dramatically depends on the usage scenario. This includes things like if the processors operqaating point (ffrequency) can be set to a lower level; if the GPU can be used by an application; the selected display resolution

@ 5V_SLEEP

Idle

Using/Running

Typ. Peak currents when running







tbd

tbd

tbd



mA

mA

A

Operating temperature
The chip temperature of processor or LPDDR4 might get hotter. The max. case temperature of 1.MX 93 is specified with xxx (consumer) and xxx (industrial).
A higher refresh-rate-setting is needed when case temperature of LPDDR4 is expected to rise above xxx .
Temperature of eMMC influence the achievable Data Retention

TConsumer

TExtended

TIndustrial

0

-25

-40

+25

+25

+25

+85

+85

+85

°C

°C

°C

3.3 ESD Ratings (tbd)

Max

Unit

V(ESD)
Electrostatic discharge

Human body model (HBM)

Charged-device model (CDM)

+/-1000

+/-250

V

V

3.4 Electrical characteristics

3.4.1 i.MX 93 GPIO DC parameters. Please view i.MX 93 tasheet for details:

Parameter

Min

Max

Unit

VIL_1V8

Low-level input voltage

-0.3

0.3 x VDD

V

VIH_1V8

High-level input voltage

0.7 x VDD

VDD + 0.3

V

VOL_1V8

High-level output voltage

0

0.2 x VDD

V

VOH_1V8

Low-level output voltage

0.8 x VDD

VDD

V

RP_up

Pull-Up Resistance

12 (typ 22)

49

kOhm

RP_down

Pull-Down Resistance

13 (typ 23)

48

kOhm

3.4.2 STM32 Cortex M0 GPIO DC parameters. Please view i.MX 93 tasheet for details:

Parameter

Min

Max

Unit

VIL_1V8

Low-level input voltage

-

0.3 x VDDIO

V

VIH_1V8

High-level input voltage

0.7 x x VDDIO

-

V

VOL_1V8

High-level output voltage

-

0.4

V

VOH_1V8

Low-level output voltage

VDDIO - 0.45

-

V

RP_up

Pull-Up Resistance

25 (typ 40)

55

kOhm

RP_down

Pull-Down Resistance

25 (typ 40)

55

kOhm

3.5 Mechanical Specification

Dimensions (mm) of the Maury module (top view)

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