• Operating Systems for i-PAN T7 II

• 3D Model for i-PAN T7 II (no warranty)

Modular system of the i-PAN HMIs

The i-PAN T7 II is a compact panel solution incl. metal housing, which may be easily integrated in customer products. It is a continued development of the i-PAN T7 and is offered with a new 7.0 inch IPS touch display (resolution 1024 x 600 pixel, brightness 500 cd/qm). The i-PAN T7 II can use different Trizeps SODIMM 200 CPU modules: Trizeps VII SOM with NXP i.MX 6, Trizeps VIII with NXP i.MX 8M, Trizeps VIII Mini/Nano/Plus with NXP i.MX 8M Mini/Nano/Plus SoC. Depending on the corresponding Trizeps CPU module the i-PAN T7 II is available with Windows 10 IoT Core/Enterprise, Windows Embedded Compact 7 or 2013, Linux and Android operating systems.
It got i-Mod flex-cable-connectors and solder-pads to extend the board functionality and connect to Seco i-Mod-Adapters and customers peripherals.

Operating Systems for i-PAN T7 II

Currently we support Windows 10 IoT Enterprise, Windows 10 IoT Core, Windows Compact 2013, Windows Embedded Compact 7, Linux and Android as operating system.

OS-Images and Tool-Chains for Linux and Android can be found at: Linux (Android,Debian,U-Boot,...).

Board Support Packages (BSP) are free for download and allow our customers to built their own OS.

Windows 10 IoT Enterprise:

• New Wiki Windows 10 IoT Enterprise page

• Press Release

Windows 10 IoT Core:

• New Wiki Windows 10 IoT Core page

3D Model for i-PAN T7 II (no warranty)

• STEP: Metal housing i-PAN T7 II (without PCBs) – Important note: Please read the 3D data disclaimer contained in the zip file.

• PDF: Details Assembly Area for i-PAN T7 II

i-PAN T7 II, Front and Back

Block diagram

Figure xxx: Simplified block diagram of i-PAN T7 II Baseboard

1 Connector Positions

Figure xxx: Connectors of i-PAN T7 II Baseboard

Connectors:

Soldering Pads

Miscellanous

2 User connectors

J400: Power connector