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Modular system of the i-PAN HMIs
The i-PAN T7 is a compact panel solution incl. metal housing, which may be easily integrated in customer products. It is offered with a 7.0 inch touch display (resolution 800 x 480 pixel, brightness 350 cd/qm). The i-PAN T7 can use different Trizeps SODIMM 200 CPU modules: Trizeps VII SOM with NXP i.MX 6, Trizeps VIII with NXP i.MX 8M, Trizeps VIII Mini with NXP i.MX 8M Mini and Trizeps VIII Nano with NXP i.MX 8M Nano. Depending on the corresponding Trizeps CPU module the i-PAN T7 is available with Windows 10 IoT Core, Windows Embedded Compact 7 or 2013, Linux and Android operating systems.
It got i-Mod flex-cable-connectors and solder-pads to extend the board functionality and connect to Seco i-Mod-Adapters and customers peripherals.
STEP: Metal housing i-PAN M7,T7 (without PCBs) – Important note: Please read the 3D data disclaimer contained in the zip file.
i-PAN T7, Front and Back
Evaluation Kit i-PAN T7 CoverLens, Front and Back
Intelligent Panel solution
Based on Trizeps CPU modules with SODIMM200 technology
7inch 24Bpp RGB Display with or without CoverLens.
capacitive touch
USB2.0 host
uSD card socket.
RJ45 10/100Mbit Ethernet with POE option.
i-MOD extension connectors with USB, I2C, CAN and GPIOs.
Currently we support Windows Embedded Compact 7, Windows Compact 2013, Linux and Android as operating system.
OS-Images and Tool-Chains for Linux and Android can be found at: Linux (Android,Debian,U-Boot,...).
For information on how to build images for Windows 10 IOT see Windows 10 IoT. (2019Q3)
Board Support Packages (BSP) are free for download and allow our customers to built their own OS.
Please do not hesitate to contact Seco to ask for other supported Operating Systems.
This panel may be equipped with one of the following modules:
Product-Brief i-PAN T7 CoverLens: PDF Infosheet i-PAN T7 CoverLens Rev.1804
Product-Brief i-PAN T7: PDF Infosheet i-PAN T7 Rev.1804
Datasheet: i-pan_t7_datasheet_v1.2.pdf