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Description

The Trizeps VIII Plus is powered by NXP i.MX 8M Plus processor, which is designed to meet the latest market requirements of connected streaming audio/video devices, scanning/imaging devices and various devices demanding high-performance and low-power. It offers a 2.3 TOP/s Neural Processing Unit (NPU) for AI-applications like pattern, object and speech recognition.

The i.MX 8M Plus family of processors features advanced implementation of a quad ARM® Cortex®-A53 core, which operates at speeds of up to 1.8GHz (consumer version) and 1.6GHz (industrial version). A general purpose Cortex®-M7 core processor is for low-power processing. A 32-bit LPDDR4 is used for memory. There are a number of other i.MX 8M Plus interfaces for connecting peripherals, such as displays, cameras, GPS and sensors, which are extended by components already available on the module:

  • a stereo, hi-fi quality audio-codec.

  • a FPGA with up to 4300 LUT to convert MIPI-DSI to parallel 24bpp display data and for user defined programmable logic.

  • a programmable Cortex-M0 Kinetis MCU, capable of realtime processing, reading multiple 16bit analog inputs or usable as resistive touch-controller.

  • WLAN 802.11 a/b/g/n/ac and Bluetooth 4.2 / 5 module

The Trizeps VIII Plus module got a SODIMM200 card edge connector and a 60pin FX11 high-speed board connector. The pinning of both connectors is to a large extent compatible to previous Trizeps modules.

Difference to Trizeps VIII

The i.MX 8M Plus processor of Trizeps VIII Plus benefits from advanced 14nm LPC FinFET Technology, which allows for lesser power-consumption and higher operating frequencies than the i.MX8 used on Trizeps VIII.

The Trizeps VIII offers:

  • support of 4K displays

It misses following features:

  • 2.3 TOP/s NPU (Neural Processing Unit)

  • 2x CAN

  • second Ethernet-MAC

  • third SDIO-port routed to SODIMM

Difference to Trizeps VIII Mini

The i.MX 8M Mini processor of Trizeps VIII Mini can be considered as the predecessor to the i.MX 8M Plus processor used on Trizeps VIII Plus.

The Trizeps VIII Mini lacks some of the interfaces:

  • 2.3 TOP/s NPU (Neural Processing Unit)

  • 2x CAN

  • second Ethernet-MAC

  • third SDIO-port routed to SODIMM

  • HDMI

  • multi-display support: only MIPI-DSI or LVDS may be used at the same time.

  • only USB2.0, instead of USB3.0 ports.

Block Diagram

Technical Documents

Manual:

Changes of key components over the revisions

 

Ethernet PHY

Audio Codec

V1R1

Qualcomm AR8031

Cirrus WM8983

V1R2

Qualcomm AR8031

Cirrus WM8983

V1R3

REALTEK RTL8211

Cirrus WM8962

V1R4

REALTEK RTL8211

Cirrus WM8962

Features and Interfaces

Features

Processor:

NXP i.MX 8M Plus ARM® Quad Cortex-A53 at up to 1.8GHz (consumer), 1.6GHz (industrial)
NXP i.MX 8M Plus ARM® Cortex-M7 at up to 800MHz
Neural Processing Unit 2.3 TOPS
NXP Kinetis V ARM® Cortex-M0+ at up to 75MHz

Memory:

Up to 8 GByte of 32-bit LPDDR4-4000

Storage:

Micro-SD socket or
4 or 8 GByte eMMC
Higher densities are available on request.

Wireless:

WLAN 802.11 a/b/g/n/ac
Bluetooth 4.2 and Bluetooth 5.0
Micro RF-antenna connector

Power:

PMIC to generate all internal and external voltages from VSYS supply.

Dimensions:

(Length x Width x Height):      67.6 x 36.7 x 6.4 mm

Interfaces / Signals accessible over connectors

  • Power Supply from +3.3V to +5V

  • 2x USB3.0 OTG port (USB Host or Slave)

  • PCIe

  • 2x SD/SDIO Card Interface

  • 4x UART

  • SPI and Quad-SPI

  • 2x I2C

  • MIPI Display (4ch) or parallel RGB Display

  • Single/Dual LVDS

  • HDMI

  • 2x Mipi Camera (4ch)

  • 1000/100/10Mbit Ethernet

  • 2x CAN/CAN-FD

  • 2x 4ch 16bit ADC

  • Stereo Headphone

  • Stereo Line-In

  • Microphone input (mono, optional stereo)

  • 1W Speaker output

  • SPDIF In and Out

  • Multi-Channel Serial-Audio-Interface

  • GPIO, PWM

1      Pin-description

The main connector of the Trizeps VIII Plus is the SODIMM200 connector.
To operate, only VSYS and GND pins need to be connected. Leave unused pins unconnected.
The U14 Board2Board connector can be omitted if the signals are not needed.
J1 and J2 may be used for debugging, programming and testing.
On the bottom side are UFL antenna connectors for the on-board WLAN + Bluetooth chip.

1.1      Pin-description (Primary Function)

The i.MX8M Plus processor, the Cortex M0+ MCU and the FPGA are highly configurable devices, where each pin may have multiple different functions.
The pin-names are derived from previous Trizeps-versions and their primary or most interesting function.
Please view chapter “1.2 Pin-Mux Information” for details on how these pins may be configured by software.

Notes:

*1) In the table below, some of the old Trizeps pin-names are placed in brackets [] for reference.

*2) FPGA_CIF_D[9..0]  / SAIx_RXD[7..0], FPGA_CIF_HSYNC, FPGA_CIF_MCLK and FPGA_CIF_PCLK are routed to the FPGA and the i.MX 8M Plus. In the following documentation they are either named FPGA_CIF_Dx or SAIx_RXDy, depending if the FPGA or i.MX 8M Plus function is described.

*3) FPGA_CIF_VSYNC, FPGA_CIF_HSYNC, FPGA_CIF_MCLK and FPGA_CIF_PCLK are connected to i.MX 8M Plus pins, if the FPGA is not mounted (RA72).

*4) BT_PCM_IN, BT_PCM_OUT, BT_PCM_SYNC and BT_PCM_CLK are connected to the on-board Bluetooth-module if it is mounted!

*5) PCIE_CLKREQ may not be usable when Wifi module is mounted.

J1: SODIMM Connector

Signal

Pin

 

Pin

Signal

AUDIO_MIC_OUT

1

 

2

VIN_AD3 (MCU)

AUDIO_MIC_GND

3

 

4

VIN_AD2 (MCU)

AUDIO_LINEIN_L

5

 

6

VIN_AD1 (MCU)

AUDIO_LINEIN_R

7

 

8

VIN_AD0 (MCU)

AUDIO_AGND

9

 

10

AUDIO_VDDA

AUDIO_AGND

11

 

12

AUDIO_VDD_SPEAKER

AUDIO_HEADPHONE_GND

13

 

14

TSPX (MCU)

AUDIO_HEADPHONE_L

15

 

16

TSMX (MCU)

AUDIO_HEADPHONE_R

17

 

18

TSPY (MCU)

UART3_RXD

19

 

20

TSMY (MCU)

UART3_TXD

21

 

22

SPIN22_RTS3

UART1_DTR

23

 

24

SPIN24_CTS3

UART1_CTS

25

 

26

RESET_IN

UART1_RTS

27

 

28

SPEAKER_R

UART1_DSR

29

 

30

SPEAKER_L

UART1_DCD

31

 

32

UART2_CTS

UART1_RXD

33

 

34

UART2_RTS

UART1_TXD

35

 

36

UART2_RXD

UART1_RI

37

 

38

UART2_TXD

GND

39

 

40

VSYS (+3V3/+5V)

GND

41

 

42

VSYS (+3V3/+5V)

SPIN43

43

 

44

LCD_EN

SPIN45

45

 

46

LCD_D07

SD2_CLK

47

 

48

LCD_D09

CIF_D0

49

 

50

LCD_D11

SD2_DATA3

51

 

52

LCD_D12

CIF_D1

53

 

54

LCD_D13

SPIN55

55

 

56

LCD_PCLK

SAI1_RXD2

57

 

58

LCD_D03

SD2_DETECT

59

 

60

LCD_D02

SAI1_RXD3

61

 

62

LCD_D08

SAI1_RXD4

63

 

64

LCD_D15

SAI1_RXD5

65

 

66

LCD_D14

SAI1_RXD6

67

 

68

LCD_HSYNC

LED_GPIO

69

 

70

LCD_D01

SAI1_RXD7

71

 

72

LCD_D05

CIF_D8

73

 

74

LCD_D10

CIF_D9

75

 

76

LCD_D00

BACKLIGHT_PWM

77

 

78

LCD_D04

POWERFAIL

79

 

80

LCD_D06

SD2_DATA1

81

 

82

LCD_VSYNC

GND

83

 

84

VSYS (+3V3/+5V)

SD2_DATA2

85

 

86

CIF_VSYNC (*3)

RESET_OUT

87

 

88

CIF_MCLK (*3)

+3V3_AUX

89

 

90

CIF_PCLK (*3)

+3V3_AUX

91

 

92

CIF_HSYNC (*3)

N.C.

93

 

94

I2C1_SCL

SPIN95 [RDY]

95

 

96

I2C1_SDA

CAN1_RX

97

 

98

GPIO_AUX

CAN1_TX

99

 

100

DISPLAY_ENABLE

CAN2_RX

101

 

102

AUDIO_ENABLE

CAN2_TX

103

 

104

SPIN104

QSPI_SCLK [CS1]

105

 

106

VSD_3V3

QSPI_SS0 [CS3]

107

 

108

VSYS (+3V3/+5V)

GND

109

 

110

SAI1_TXD0

QSPI_DATA0 [A00]

111

 

112

SAI1_TXD1

QSPI_DATA1 [A01]

113

 

114

SAI1_TXD2

PCIE_CLKREQ (*5)

115

 

116

SAI1_TXD3

QSPI_DATA2 [A03]

117

 

118

SAI1_TXD4

QSPI_DATA3 [A04]

119

 

120

SAI1_TXD5

SPIN121 [A05]

121

 

122

SAI1_TXD6

CSI1_PWDN [A06]

123

 

124

SAI1_TXD7

CSI1_RESET [A07]

125

 

126

SAI1_TXFS

USB1_PEN

127

 

128

SAI1_TXC

USB2_PEN

129

 

130

HDMI_DDC_SCL

USB2_OC

131

 

132

N.C.

USB1_OC

133

 

134

SPIN134

USB1_VBUS

135

 

136

SPIN136

USB1_ID

137

 

138

USB1_RXP

USB1_DP

139

 

140

USB1_RXN

USB1_DN

141

 

142

USB1_TXP

USB2_DP

143

 

144

USB1_TXN

USB2_DN

145

 

146

BT_PCM_IN (*4)

GND

147

 

148

VSYS (+3V3/+5V)

HDMI_DDC_SDA

149

 

150

LCD_D16

USB2_TXP

151

 

152

LCD_D17

USB2_TXN

153

 

154

PCIE_WAKE

USB2_RXP

155

 

156

VDD_FPGA_MIPI

USB2_RXN

157

 

158

PCIE_CLK_N

SPDIF_IN [D05]

159

 

160

PCIE_CLK_P

SPDIF_OUT [D06]

161

 

162

PCIE_TX_P

SPDIF_EXT_CLK [D07]

163

 

164

PCIE_TX_N

LED_WL

165

 

166

PCIE_RX_P

LED_BT [D09]

167

 

168

PCIE_RX_N

VDD_ENET_IO [D10]

169

 

170

FPGA_LCD_D21 or SD3_DATA0

ETH_LED_SPEED1000 [D11]

171

 

172

FPGA_LCD_D20 or SD3_DATA1

ETH_TRX2_N [D12]

173

 

174

FPGA_LCD_D19 or SD3_DATA2

ETH_TRX2_P [D13]

175

 

176

FPGA_LCD_D18 or SD3_DATA3

ETH_TRX3_N [D14]

177

 

178

FPGA_LCD_D23 or SD3_CLK

ETH_TRX3_P [D15]

179

 

180

FPGA_LCD_D22 or SD3_CMD

GND

181

 

182

VSYS (+3V3/+5V)

ETH_LED_LINK_AKT

183

 

184

BT_PCM_OUT (*4)

ETH_LED_SPEED100

185

 

186

BT_PCM_CLK (*4)

ETH_TRX0_N

187

 

188

BT_PCM_SYNC (*4)

ETH_TRX0_P

189

 

190

SD2_CMD

ETH_GND

191

 

192

SD2_DATA0

ETH_TRX1_N

193

 

194

I2C2_SDA

ETH_TRX1_P

195

 

196

I2C2_SCL

GND

197

 

198

VSYS (+3V3/+5V)

GND

199

 

200

VCC_SNVS (+3V3)

 

J2: Board2Board Connector

Signal

Pin

 

Pin

Signal

MIPI_CSI1_D2_P

1

 

2

MIPI_DSI_D3_P

MIPI_CSI1_D2_N

3

 

4

MIPI_DSI_D3_N

MIPI_CSI1_D3_P

5

 

6

MIPI_DSI_D2_P

MIPI_CSI1_D3_N

7

 

8

MIPI_DSI_D2_N

MIPI_CSI2_CLK_P

9

 

10

LVDS1_TX2_P

GND

11

 

12

GND

MIPI_CSI2_CLK_N

13

 

14

LVDS1_TX2_N

MIPI_CSI2_D0_P

15

 

16

LVDS1_TX3_N

MIPI_CSI2_D0_N

17

 

18

LVDS1_TX3_P

MIPI_CSI2_D1_P

19

 

20

LVDS1_CLK_P

MIPI_CSI2_D1_N

21

 

22

LVDS1_CLK_N

MIPI_CSI2_D2_P

23

 

24

LVDS1_TX0_P

MIPI_CSI2_D2_N

25

 

26

LVDS1_TX0_N

MIPI_CSI2_D3_P

27

 

28

LVDS1_TX1_P

MIPI_CSI2_D3_N

29

 

30

LVDS1_TX1_N

MIPI_DSI_D1_P

31

 

32

MIPI_DSI_D1_N

GND

33

 

34

GND

LVDS0_TX1_N

35

 

36

MIPI_DSI_CLK_N

LVDS0_TX1_P

37

 

38

MIPI_DSI_CLK_P

LVDS0_TX0_P

39

 

40

HDMI_TX1_P

LVDS0_TX0_N

41

 

42

HDMI_TX1_N

LVDS0_CLK_N

43

 

44

HDMI_TX2_P

LVDS0_CLK_P

45

 

46

HDMI_TX2_N

LVDS0_TX2_P

47

 

48

HDMI_HPD

LVDS0_TX2_N

49

 

50

HDMI_CLK_N

LVDS0_TX3_P

51

 

52

HDMI_CLK_P

LVDS0_TX3_N

53

 

54

HDMI_CEC

GND

55

 

56

GND

MIPI_DSI_D0_N

57

 

58

HDMI_TX0_N

MIPI_DSI_D0_P

59

 

60

HDMI_TX0_P

MIPI_CSI1_D0_N

61

 

62

MIPI_CSI1_CLK_N

MIPI_CSI1_D0_P

63

 

64

MIPI_CSI1_CLK_P

MIPI_CSI1_D1_P

65

 

66

MIPI_CSI1_D1_N

GND

67

 

68

GND

  

J90: i.MX8M JTAG Connector

This flex-cable-connector uses the SECO Northern Europe JTAG connector standard. An Adapter to Multi-ICE pin-header is available.

Pin

Signal

1

+3V3

2

GND

3

JTAG_TMS

4

N.C.

5

JTAG_TCK

6

JTAG_TDO

7

JTAG_TDI

8

JTAG_RESET_N

 

J91: FPGA & MCU JTAG Connector

This flex-cable-connector uses the SECO Northern Europe JTAG connector standard. An adapter to Multi-ICE pin-header is available.

Pin

Signal

1

VDD_FPGA_MIPI

2

GND

3

FPGA_JTAG_TMS

4

SWD_CLK

5

FPGA_JTAG_TCK

6

FPGA_JTAG_TDO

7

FPGA_JTAG_TDI

8

SWD_DIO

1.2 Pin-Mux Information

Several pins are GPIOs which may be configured for different functions by software.
Please check with the processor datasheet for additional pin-mux information.
An Excel-Sheet with pin-information is available at: https://documentation.seco.com/service/doku.php/service/hardware/module/sodimm200

Notes:

 *3) FPGA_CIF_VSYNC, FPGA_CIF_HSYNC, FPGA_CIF_MCLK and FPGA_CIF_PCLK are connected to i.MX 8M Plus pins, if the FPGA is not mounted (RA72).

 *4) BT_PCM_IN, BT_PCM_OUT, BT_PCM_SYNC and BT_PCM_CLK are connected to the on-board Bluetooth-module if it is mounted!

 *5) PCIE_CLKREQ may not be usable when Wifi module is mounted.

1.2.1  i.MX 8M Plus pins

The i.MX 8M Plus pins got up to 10 different functions. Only the more common used are listed.

PIN

Name

Alt0

Alt1

Alt2 / Alt3

Alt5

19

UART3_RXD

ecspi1.SCLK

uart3.RX

 

gpio5.IO[6]

21

UART3_TXD

ecspi1_MOSI

uart3.TX

 

gpio5.IO[7]

22

SPIN22_RTS3

ecspi1.MISO

uart3.CTS_B

 

gpio5.IO[8]

23

UART1_DTR

sai5.RX_SYNC

sai1.TX_DATA[0]

 

gpio3.IO[19]

24

SPIN24_CTS3

ecspi1.SS0

uart3.RTS_B

 

gpio5.IO[9]

25

UART1_CTS

uart3.TX

uart1.RTS_B

 

gpio5.IO[27]

27

UART1_RTS

uart3.RX

uart1.CTS_B

 

gpio5.IO[26]

29

UART1_DSR

sai5.RX_BCLK

sai1.TX_DATA[1]

 

gpio3.IO[20]

31

UART1_DCD

sai2.RX_SYNC

sai5.TX_SYNC

sai5.TX_DATA[1]

gpio4.IO[21]

32

UART2_CTS

uart4.TX

uart2.RTS_B

 

gpio5.IO[29]

33

UART1_RXD

uart1.RX

ecspi3.SCLK

 

gpio5.IO[22]

34

UART2_RTS

uart4.RX

uart2.CTS_B

pcie1.CLKREQ_B

gpio5.IO[28]

35

UART1_TXD

uart1.TX

ecspi3.MOSI

 

gpio5.IO[23]

36

UART2_RXD

uart2.RX

ecspi3.MISO

 

gpio5.IO[24]

37

UART1_RI

sai2.RX_BCLK

sai5.TX_BCLK

 

gpio4.IO[22]

38

UART2_TXD

uart2.TX

ecspi3.SS0

 

gpio5.IO[25]

43

SPIN43

gpio1.IO[7]

 

 

usdhc1.WP

45

SPIN45

rawnand.CE3_B

qspi.B_SS1_B

 

gpio3.IO[4]

47

SD2_CLK

usdhc2.CLK

 

 

gpio2.IO[13]

49

SAI1_RXD0

sai1.RX_DATA[0]

sai5.RX_DATA[0]

sai1.TX_DATA[1]

gpio4.IO[2]

51

SD2_DATA3

usdhc2.DATA3

 

 

gpio2.IO[18]

53

SAI1_RXD1

sai1.RX_DATA[1]

sai5.RX_DATA[1]

 

gpio4.IO[3]

55

SPIN55

sai5.RX_DATA[0]

sai1.TX_DATA[2]

 

gpio3.IO[21]

57

SAI1_RXD2

sai1.RX_DATA[2]

sai5.RX_DATA[2]

enet1_MDC

gpio4.IO[4]

59

SD2_DET

usdhc2.CD_B

 

 

gpio2.IO[12]

61

SAI1_RXD3

sai1.RX_DATA[3]

sai5.RX_DATA[3]

enet1_MDIO

gpio4.IO[5]

63

SAI1_RXD4

sai1.RX_DATA[4]

sai6.TX_BCLK

enet1_RD0

gpio4.IO[6]

65

SAI1_RXD5

sai1.RX_DATA[5]

sai6.TX_DATA[0]

sai1.RX_SYNC
enet1_RD1

gpio4.IO[7]

67

SAI1_RXD6

sai1.RX_DATA[6]

sai6.TX_SYNC

sai6.RX_SYNC
enet1_RD2

gpio4.IO[8]

69

LED_GPIO

sai3.MCLK

pwm4.OUT

sai5.MCLK

gpio5.IO[2]

71

SAI1_RXD7

sai1.RX_DATA[7]

sai6.MCLK

sai1.TX_SYNC
sai1.TX_DATA[4]
enet1_RD3

gpio4.IO[9]

73

SAI5_RXD1

sai5.RX_DATA[1]

sai1.TX_DATA[3]

sai1.TX_SYNC
sai5.TX_SYNC

gpio3.IO[22]

75

SAI5_RXD2

sai5.RX_DATA[2]

sai1.TX_DATA[4]

sai1.TX_SYNC
sai5.TX_BCLK

gpio3.IO[23]

77

BACKLIGHT_PWM

gpio1.IO[1]

pwm1.OUT

 

anamix.REF_
CLK_24M

79

SPIN79

sai5.RX_DATA[3]

sai1.TX_DATA[5]

sai1.TX_SYNC
sai5.TX_DATA[0]

gpio3.IO[24]

81

SD2_DATA1

usdhc2.DATA1

 

 

gpio2.IO[16]

85

SD2_DATA2

usdhc2.DATA2

 

 

gpio2.IO[17]

86

CIF_VSYNC *3)

ecspi2.SS0

uart4.RTS_B

 

gpio5.IO[13]

87

RESET_OUT

gpio3.IO[14]

 

 

 

88

SAI1_MCLK

CIF_MCLK *3)

sai1.MCLK

ecspi2.SCLK

sai5.MCLK

uart4.RX

sai1.TX_BCLK

gpio4.IO[20]

gpio5.IO[10]

90

SAI1_RXC

CIF_PCLK *3)

sai1.RX_BCLK

ecspi2.MISO

sai5.RX_BCLK

uart4.CTS_B

 

gpio4.IO[1]

gpio5.IO[12]

92

SAI1_RXFS

CIF_HSYNC *3)

sai1.RX_SYNC

ecspi2.MOSI

sai5.RX_SYNC

uart4.TX

 

gpio4.IO[0]

gpio5.IO[11]

93

SPIN93

rawnand.WP_B

 

 

gpio3.IO[18]

94

I2C1_SCL

i2c1.SCL

enet1.MDC

 

gpio5.IO[14]

95

SPIN95

rawnand.READY_B

 

 

gpio3.IO[16]

96

I2C1_SDA

i2c1.SDA

enet1.MDIO

 

gpio5.IO[15]

98

SPIN98

gpio1.IO[0]

ccmsrcgpcmix.ENET_PHY_REF_CLK_ROOT

 

anamix.REF_
CLK_32K

100

DISPLAY_ENABLE

gpio1.IO[5]

m4.NMI

 

ccmsrcgpcmix.PMIC_READY

101

SPIN101

sai3.TX_SYNC

gpt1.CAPTURE2

sai5.RX_DATA[1]

gpio4.IO[31]

102

AUDIO_ENABLE

gpio1.IO[8]

enet1.1588_
EVENT0_IN

 

usdhc2.RESET_
B

103

SPIN103

sai3.TX_BCLK

gpt1.COMPARE2

sai5.RX_DATA[2]

gpio5.IO[0]

104

SPIN104

rawnand.DATA05

qspi.B_DATA[1]

 

gpio3.IO[11]

105

QSPI_SCLK

rawnand.ALE

qspi.A_SCLK

 

gpio3.IO[0]

106

SAI5_MCLK

sai5.MCLK

sai1.TX_BCLK

 

gpio3.IO[25]

107

QSPI_SS0

rawnand.CE0_B

qspi.A_SS0_B

 

gpio3.IO[1]

110

SAI1_TXD0

sai1.TX_DATA[0]

sai5.TX_DATA[0]

enet1_TD0

gpio4.IO[12]

111

QSPI_DATA0

rawnand.DATA00

qspi.A_DATA[0]

 

gpio3.IO[6]

112

SAI1_TXD1

sai1.TX_DATA[1]

sai5.TX_DATA[1]

enet1_TD1

gpio4.IO[13]

113

QSPI_DATA1

rawnand.DATA01

qspi.A_DATA[1]

 

gpio3.IO[7]

114

SAI1_TXD2

sai1.TX_DATA[2]

sai5.TX_DATA[2]

enet1_TD2

gpio4.IO[14]

115

PCIE_CLKREQ (*5)

i2c4.SCL

pwm2.OUT

pcie1.CLKREQ_B

gpio5.IO[20]

116

SAI1_TXD3

sai1.TX_DATA[3]

sai5.TX_DATA[3]

enet1_TD3

gpio4.IO[15]

117

QPSPI_DATA2

rawnand.DATA02

qspi.A_DATA[2]

 

gpio3.IO[8]

118

SAI1_TXD4

sai1.TX_DATA[4]

sai6.RX_BCLK

sai6.TX_BCLK
enet1_TX_CTL

gpio4.IO[16]

119

QSPI_DATA3

rawnand.DATA03

qspi.A_DATA[3]

 

gpio3.IO[9]

120

SAI1_TXD5

sai1.TX_DATA[5]

sai6.RX_DATA[0]

sai6.TX_DATA[0]
enet1_TXC

gpio4.IO[17]

121

SPIN121

rawnand.DATA04

qspi.B_DATA[0]

 

gpio3.IO[10]

122

SAI1_TXD6

sai1.TX_DATA[6]

sai6.RX_SYNC

sai6.TX_SYNC

gpio4.IO[18]

123

CSI1_PWDN

gpio1.IO[3]

usdhc1.VSELECT

 

sdma1.EXT_
EVENT[0]

124

SAI1_TXD7

sai1.TX_DATA[7]

sai6.MCLK

 

gpio4.IO[19]

125

CSI_RESET

gpio1.IO[6]

enet1.MDC

 

usdhc1.CD_B

126

SAI1_TXFS

sai1.TX_SYNC

sai5.TX_SYNC

enet1_RX_CTL

gpio4.IO[10]

127

USB1_PEN

gpio1.IO[12]

usb1.OTG_PWR

 

sdma2.EXT_
EVENT[1]

128

SAI1_TXC

sai1.TX_BCLK

sai5.TX_BCLK

 

enet1_rxc/gpio4.IO[11]

129

USB2_PEN

gpio1.IO[14]

usb2.OTG_PWR

 

pwm3.OUT

131

USB2_OC

gpio1.IO[15]

usb2.OTG_OC

 

pwm4.OUT

132

SPIN32

rawnand.DATA06

qspi.B_DATA[2]

 

gpio3.IO[12]

133

USB1_OC

gpio1.IO[13]

usb1.OTG_OC

 

pwm2.OUT

134

USB1_PD_INT

rawnand.CE2_B

qspi.B_SS0_B

 

gpio3.IO[3]

136

USB1_SS_SEL

rawnand.RE_B

qspi.B_DQS

 

gpio3.IO[15]

146

BT_PCM_IN *4)

sai3.TX_DATA[0]

gpt1.COMPARE3

sai5.RX_DATA[3]

gpio5.IO[1]

154

PCIE_WAKE

rawnand.DATA07

qspi.B_DATA[3]

 

gpio3.IO[13]

159

SPDIF_IN

spdif1.IN

pwm2.OUT

 

gpio5.IO[4]

161

SPDIF_OUT

spdif1.OUT

pwm3.OUT

 

gpio5.IO[3]

163

SPDIF_EXT_CLK

spdif1.EXT_CLK

pwm1.OUT

 

gpio5.IO[5]

184

BT_PCM_OUT *4)

sai3.RX_DATA[0]

gpt1.COMPARE1

sai5.RX_DATA[0]

gpio4.IO[30]

186

BT_PCM_CLK *4)

sai3.RX_BCLK

gpt1.CLK

sai5.RX_BCLK

gpio4.IO[29]

188

BT_PCM_SYNC *4)

sai3.RX_SYNC

gpt1.CAPTURE1

sai5.RX_SYNC

gpio4.IO[28]

190

SD2_CMD

usdhc2.CMD

 

 

gpio2.IO[14]

192

SD2_DATA0

usdhc2.DATA0

 

 

gpio2.IO[15]

194

I2C2_SDA

i2c2.SDA

enet1.1588_EVENT1_
OUT

 

gpio5.IO[17]

196

I2C2_SCL

i2c2.SCL

enet1.1588_EVENT1_
IN

 

gpio5.IO[16]

 

1.2.2  Kinetis MCU pins

Several pins are GPIOs which may be configured for different functions by software.
Please check with the microcontroller datasheet for additional pin-mux information.

PIN

Name

Alt0

Alt1

Alt2

Alt3

Alt4

Alt5

Alt6

Alt7

2

VIN_AD3

ADC0_SE7
ADC1_SE7
ADC1_DM1

PTE19

SPI0_SIN

UART1_
RTS

I2C0_
SCL

 

SPI0_
SOUT

 

4

VIN_AD2

ADC0_SE6
ADC1_SE1
ADC1_DP1

PTE18
LLWI_P20

SPI0_SOUT

UART1_
CTS

I2C0_
SDA

 

SPI0_
SIN

 

 

6

VIN_AD1

ADC0_DM
ADC0_SE5
ADC1_SE5

PTE17
LLWI_P19

SPI0_SCK

UART1_
RX

FTM_
CLKIN1

 

LPTMR0_
ALT3

 

8

VIN_AD0

ADC0_SE1
ADC0_DP
ADC1_SE0

PTE16

SPI0_PCS0

UART1_
TX

FTM_
CLKIN0

 

FTM_
FLT3

 

14

TSPX

ADC0_SE8
ADC1_SE8

PTB0
LLWU_P5

I2C0_SCL

FTM1_
CH0

 

 

FTM1_
QD_PHA

UART0_
RX

16

TSMX

ADC0_SE9
ADC1_SE9

PTB1

I2C0_SDA

FTM1_
CH1

FTM0_
FLT2

EWM_
IN

FTM1_
QD_PHB

UART0_
TX

18

TSPY

ADC0_SE11
CMP1_IN0

PTC2

SPI0_PCS2

UART1_
CTS

FTM0_
CH1

FTM2_
CH1

 

 

20

TSMY

ADC1_SE4
CMP1_IN4
DAC0_OUT

PTE30

 

FTM0_
CH3

 

FTM_
CLKIN1

 

 

24

SPIN24_
CTS3

 

PTA4
LLWU_P3

 

FTM0_
CH1

FTM4_
FLT0

FTM0_
FLT3

 

NMI_b

26

RESET_IN

 

PTA20

 

 

 

 

 

RESET

97

CAN1_RX

 

PTE25
LLWU_P21

CAN0
_RX

FTM0_
CH1

 

I2C0_
SDA

EWM_
IN

 

99

CAN1_TX

 

PTE24

CAN0
_TX

FTM0_
CH0

 

I2C0_
SCL

EWM_
OUT

 

*) Only MKV11 MCU, not usable with MKV10 MCU.

 ADC_SE          Single-Ended ADC
ADC_DM/P      Differential ADC
LLWU              Wakeup-Sources
EWM               External Watchdog Monitor
FTM                 Flexible Timer Module
FTM_CH          Output Channel
FTM_FLT         Fault
FTM_QD_PH   Quadrature Decoder

1.3 Electrical Pin-Information

PI:

Power Input

 

DO:

Digital Output

PO:

Power Output

 

DIO:

Digital Input/Output

 

 

 

DDI:

Differential Input

AI:

Analog Input

 

DDO:

Differential Output

AO:

Analog Output

 

DDIO:

Differential Input/Output

 

 

 

 

 

DI:

Digital Input

 

OD

Open-Drain Output

 

 

 

 

 

PD:

Pull-Down

(PDp: Pull-Down, Pull-behavior can be changed by software)

PU:

Pull-Up

PUp: Pull-Up, Pull-behavior can be changed by software

If two “types” are specified, the first value determines the type of primary

SODIMM

PIN

Name

Type

Voltage

Connected to

1

AUDIO_MIC_OUT

AI

 

Audio-Codec

3

AUDIO_MIC_GND

AI

 

Audio-Codec

5

AUDIO_LINEIN_L

AI

 

Audio-Codec

7

AUDIO_LINEIN_R

AI

 

Audio-Codec

9

AUDIO_AGND

Analog Audio
Ground 

 

Audio-Codec and VREF-
of Kinetis MCU

11

AUDIO_AGND

13

AUDIO_HEADPHONE_GND

AI

 

Audio-Codec

15

AUDIO_HEADPHONE_L

AO

 

Audio-Codec

17

AUDIO_HEADPHONE_R

AO

 

Audio-Codec

19

UART3_RXD

DI, DIO

NVCC_3V3

i.MX8M and
Bluetooth module, if no FPGA (RA600)

21

UART3_TXD

DO, DIO

NVCC_3V3

SPI1_CLK

23

UART1_DTR

DO, DIO

NVCC_3V3

i.MX8M

25

UART1_CTS

DI, DIO

NVCC_3V3

i.MX8M

27

UART1_RTS

DO, DIO

NVCC_3V3

i.MX8M

29

UART1_DSR

DI, DIO

NVCC_3V3

i.MX8M

31

UART1_DCD

DI, DIO

NVCC_3V3

i.MX8M

33

UART1_RXD

DI, DIO

NVCC_3V3

i.MX8M

35

UART1_TXD

DO, DIO

NVCC_3V3

i.MX8M

37

UART1_RI

DI, DIO

NVCC_3V3

i.MX8M

39

GND

Ground

41

GND

43

SPIN43

DIO

NVCC_3V3

i.MX8M

45

SPIN45

DIO

NVCC_3V3

i.MX8M

47

SD2_CLK

DO, DIO

NVCC_3V3

i.MX8M

49

CIF_D0

DI, DIO

NVCC_3V3

i.MX8M

51

SD2_DATA3

DIO

NVCC_3V3

i.MX8M

53

CIF_D1

DI, DIO

NVCC_3V3

i.MX8M

55

SPIN55

DIO

NVCC_3V3

i.MX8M

57

SAI1_RXD2

DI, DIO

NVCC_3V3

i.MX8M

59

SD2_DET

DI, DIO

NVCC_3V3

i.MX8M

61

SAI1_RXD3

DI, DIO

NVCC_3V3

i.MX8M

63

SAI1_RXD4

DI, DIO

NVCC_3V3

i.MX8M

65

SAI1_RXD5

DI, DIO

NVCC_3V3

i.MX8M

67

SAI1_RXD6

DI, DIO

NVCC_3V3

i.MX8M

69

LED_GPIO, PWM4

DO, DIO

NVCC_3V3

i.MX8M

71

SAI1_RXD7

DI, DIO

NVCC_3V3

i.MX8M

73

CIF_D8

DI, DIO

NVCC_3V3

i.MX8M

75

CIF_D9

DI, DIO

NVCC_3V3

i.MX8M

77

BACKLIGHT_PWM

DO, DIO

NVCC_3V3

i.MX8M

79

SPIN79

DI, DIO

NVCC_3V3

i.MX8M

81

SD2_DATA1

DIO

NVCC_3V3

i.MX8M

83

GND

Ground 

85

SD2_DATA2

DIO

NVCC_3V3

i.MX8M

87

RESET_OUT

DO

NVCC_3V3

FPGA + i.MX8M + Kinetis MCU

89

+3V3_AUX (NVCC_3V3)

PO

+3V3

NVCC_3V3

91

+3V3_AUX (NVCC_3V3)

93

 -

 

 

 

95

SPIN95

DIO

NVCC_3V3

i.MX8M

97

CAN1_RX

DI, DIO

NVCC_3V3

i.MX8M

99

CAN1_TX

DO, DIO

101

CAN2_RX

DI, DIO

NVCC_3V3

i.MX8M

103

CAN2_TX

DO, DIO

105

QSPI_SCLK (CS1)

DO, DIO

NVCC_3V3

i.MX8M

107

QSPI_SS0 ( CS3)

DO, DIO

NVCC_3V3

i.MX8M

109

GND

Ground 

111

QSPI_DATA0 (A00)

DIO

NVCC_3V3

i.MX8M

113

QSPI_DATA1 (A01)

DIO

NVCC_3V3

i.MX8M

115

PCIE_CLKREQ

DIO

NVCC_3V3

i.MX8M

117

QPSPI_DATA2 (A03)

DIO

NVCC_3V3

i.MX8M

119

QSPI_DATA3 (A04)

DIO

NVCC_3V3

i.MX8M

121

SPIN121 (A05)

DIO

NVCC_3V3

i.MX8M

123

CSI1_PWDN

DO, DIO

NVCC_3V3

i.MX8M

125

CSI_RESET

DO, DIO

NVCC_3V3

i.MX8M

127

USB1_PEN

DO, DIO

NVCC_3V3

i.MX8M

129

USB2_PEN

DO, DIO

NVCC_3V3

i.MX8M

131

USB2_OC

DI, DIO

NVCC_3V3

i.MX8M

133

USB1_OC

DI, DIO

NVCC_3V3

i.MX8M

135

USB1_VBUS

DI (PO)

+5V

i.MX8M

137

USB1_ID

DI

NVCC_3V3

i.MX8M

139

USB1_DP

DDIO

NVCC_3V3

i.MX8M

141

USB1_DN

DDIO

NVCC_3V3

i.MX8M

143

USB2_DP

DDIO

NVCC_3V3

i.MX8M

145

USB2_DN

DDIO

NVCC_3V3

i.MX8M

147

GND

Ground

149

HDMI_DDC_SDA

DIO

NVCC_3V3

i.MX8M

151

USB2_TX_P

DDIO

NVCC_3V3

i.MX8M

153

USB2_TX_N

DDIO

NVCC_3V3

i.MX8M

155

USB2_RX_P

DDIO

NVCC_3V3

i.MX8M

157

USB2_RX_N

DDIO

NVCC_3V3

i.MX8M

159

SPDIF_IN

DI, DIO

NVCC_3V3

i.MX8M

161

SPDIF_OUT

DO, DIO

NVCC_3V3

i.MX8M

163

SPDIF_EXT_CLK

DI, DIO

NVCC_3V3

i.MX8M

165

LED_WL

DO

NVCC_3V3

Wifi

167

LED_BT

DO

NVCC_3V3

BT

169

VDD_ENET_IO

PO

Ethernet signal
IO voltage

 

171

ETH_LED_SPEED1000

OD

NVCC_3V3

Gbit Ethernet-Phy

173

ETH_TRX2_N

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

175

ETH_TRX2_P

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

177

ETH_TRX3_N

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

179

ETH_TRX3_P

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

181

GND

Ground

183

ETH_LED_LINK_AKT

OD

NVCC_3V3

Gbit Ethernet-Phy

PIN

Name

Type

Voltage

Connected to

185

ETH_LED_SPEED100

OD

NVCC_3V3

Gbit Ethernet-Phy

187

ETH_TRX0_N

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

189

ETH_TRX0_P

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

191

ETH_GND

Ground

193

ETH_TRX1_N

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

195

ETH_TRX1_P

DDIO

VDD_ENET_IO

Gbit Ethernet-Phy

197

GND

Ground

199

GND

2

VIN_AD3

AI, DIO

VCC_SNVS

Kinetis MCU, PTE16: ADC0_SE1

4

VIN_AD2

AI, DIO

VCC_SNVS

Kinetis MCU, PTE17: ADC0_SE5

6

VIN_AD1

AI, DIO

VCC_SNVS

Kinetis MCU, PTE18: ADC0_SE6

8

VIN_AD0

AI, DIO

VCC_SNVS

Kinetis MCU, PTE19: ADC0_SE7

10

AUDIO_VDDA

PI

AUDIO_VDD

Audio-Codec and VREF+
of Kinetis MCU

12

AUDIO_VDD_SPEAKER

PI

VDD_SPEAKER

Audio-Codec and VREF+
of Kinetis MCU

14

TSPX

AI, DIO

VCC_SNVS

Kinetis MCU, PTB0: ADC1_SE8

16

TSMX

AI, DIO

VCC_SNVS

Kinetis MCU, PTB1: ADC1_SE9

18

TSPY

AI, DIO

VCC_SNVS

Kinetis MCU, PTC2: ADC0_SE11, CMP1_IN0

20

TSMY

AI, DIO

VCC_SNVS

Kinetis MCU, PTE30: ADC1_SE4,  CMP1_IN4

22

SPIN22_RTS3

DO, DIO

NVCC_3V3

i.MX8M and
Bluetooth module,
if no FPGA (RA600)

24

SPIN24_CTS3

DI, DIO

NVCC_3V3
VCC_SNVS

Kinetis MCU, i.MX8M and
Bluetooth module,
if no FPGA (RA600)
optional ONOFF (R627),
optional BOOT_MODE0 (R628)

26

RESET_IN

DI

VCC_SNVS

Kinetis MCU and Reset-Circuit

28

SPEAKER_P

AO

VDD_SPEAKER

Audio-Codec

30

SPEAKER_N

AO

32

UART2_CTS

DI, DIO

NVCC_3V3

i.MX8M

34

UART2_RTS

DO, DIO

NVCC_3V3

i.MX8M

36

UART2_RXD

DI, DIO

NVCC_3V3

i.MX8M

38

UART2_TXD

DO, DIO

NVCC_3V3

i.MX8M

40

VSYS

PI

+3V3/+5V

42

VSYS

44

LCD_DE

DO, DIO

NVCC_3V3

FPGA

46

LCD_D07

DO, DIO

NVCC_3V3

FPGA

48

LCD_D09

DO, DIO

NVCC_3V3

FPGA

50

LCD_D11

DO, DIO

NVCC_3V3

FPGA

52

LCD_D12

DO, DIO

NVCC_3V3

FPGA

54

LCD_D13

DO, DIO

NVCC_3V3

FPGA

56

LCD_PCLK

DO, DIO

NVCC_3V3

FPGA

58

LCD_D03

DO, DIO

NVCC_3V3

FPGA

60

LCD_D02

DO, DIO

NVCC_3V3

FPGA

62

LCD_D08

DO, DIO

NVCC_3V3

FPGA

64

LCD_D15

DO, DIO

NVCC_3V3

FPGA

66

LCD_D14

DO, DIO

NVCC_3V3

FPGA

68

LCD_HSYNC

DO, DIO

NVCC_3V3

FPGA

70

LCD_D01

DO, DIO

NVCC_3V3

FPGA

72

LCD_D05

DO, DIO

NVCC_3V3

FPGA

74

LCD_D10

DO, DIO

NVCC_3V3

FPGA

76

LCD_D00

DO, DIO

NVCC_3V3

FPGA

78

LCD_D04

DO, DIO

NVCC_3V3

FPGA

80

LCD_D06

DO, DIO

NVCC_3V3

FPGA

82

LCD_VSYNC

DO, DIO

NVCC_3V3

FPGA

84

VSYS

PI

+3V3/+5V

86

CIF_VSYNC
SPI2_SS0

DO, DIO

NVCC_3V3

FPGA,
RA3 optional route to i.MX8M SPI2_SS0

88

CIF_MCLK
SPI2_SCLK

DO, DIO

NVCC_3V3

FPGA,
RA3 optional route to i.MX8M SPI2_SCLK

90

CIF_PCLK
SPI2_MISO

DO, DIO

NVCC_3V3

FPGA,
RA3 optional route to i.MX8 SPI2_MISO

92

CIF_HSYNC
SPI2_MOSI

DO, DIO

NVCC_3V3

FPGA,
RA3 optional route to i.MX8 SPI2_MOSI

94

I2C1_SCL

DO, DIO

NVCC_3V3

i.MX8M

96

I2C1_SDA

DO, DIO

NVCC_3V3

i.MX8M

98

SPIN98

DIO

NVCC_3V3

i.MX8M

100

DISPLAY_ENABLE

DO, DIO

NVCC_3V3

i.MX8M

102

AUDIO_ENABLE

DO, DIO

NVCC_3V3

i.MX8M

104

SPIN104

DIO

NVCC_3V3

i.MX8M

106

VSD_3V3

PO

+3V3 (switchable)

108

VSYS

PI

+3V3/+5V

110

SAI1_TXD0

DO, DIO

NVCC_3V3

i.MX8M

112

SAI1_TXD1

DO, DIO

NVCC_3V3

i.MX8M

114

SAI1_TXD2

DO, DIO

NVCC_3V3

i.MX8M

116

SAI1_TXD3

DO, DIO

NVCC_3V3

i.MX8M

118

SAI1_TXD4

DO, DIO

NVCC_3V3

i.MX8M

120

SAI1_TXD5

DO, DIO

NVCC_3V3

i.MX8M

122

SAI1_TXD6

DO, DIO

NVCC_3V3

i.MX8M

124

SAI1_TXD7

DO, DIO

NVCC_3V3

i.MX8M

126

SAI1_TXFS

DO, DIO

NVCC_3V3

i.MX8M

128

SAI1_TXC

DO, DIO

NVCC_3V3

i.MX8M

130

HDMI_DDC_SCL

DO,DIO

NVCC_3V3

i.MX8M

132

 -

 

 

 

134

SPIN134

DIO

NVCC_3V3

i.MX8M

136

SPIN136

DIO

NVCC_3V3

i.MX8M

138

USB1_RX_P

DDIO

NVCC_3V3

i.MX8M

140

USB1_RX_N

DDIO

NVCC_3V3

i.MX8M

142

USB1_TX_P

DDIO

NVCC_3V3

i.MX8M

144

USB1_TX_N

DDIO

NVCC_3V3

i.MX8M

146

BT_PCM_IN

DI, DIO

NVCC_3V3

i.MX8M and Bluetooth-Module

148

VSYS

PI

+3V3/+5V

150

LCD_D16

DO, DIO

NVCC_3V3

FPGA

152

LCD_D17

DO, DIO

NVCC_3V3

FPGA

154

PCIE_WAKE

DO, DIO

NVCC_3V3

i.MX8M

156

VDD_FPGA_MIPI

PO

+2V5 (programmable)

158

PCIE_REFCLK_N

DDO

NVCC_3V3

i.MX8M

160

PCIE_REFCLK_P

DDO

NVCC_3V3

i.MX8M

162

PCIE_TXN_P

DDO

NVCC_3V3

i.MX8M

164

PCIE_TXN_N

DDO

NVCC_3V3

i.MX8M

166

PCIE_RXN_P

DDI

NVCC_3V3

i.MX8M

168

PCIE_RXN_N

DDI

NVCC_3V3

i.MX8M

170

LCD_D21
SD3_DATA0

DO, DIO

NVCC_3V3

FPGA and i.MX8M

172

LCD_D20
SD3_DATA1

DO, DIO

NVCC_3V3

FPGA and i.MX8M

174

LCD_D19
SD3_DATA2

DO, DIO

NVCC_3V3

FPGA and i.MX8M

176

LCD_D18
SD3_DATA3

DO, DIO

NVCC_3V3

FPGA and i.MX8M

178

LCD_D23
SD3_CLK

DO, DIO

NVCC_3V3

FPGA and i.MX8M

180

LCD_D22
SD3_CMD

DO, DIO

NVCC_3V3

FPGA and i.MX8M

182

VSYS

PI

+3V3/+5V

184

BT_PCM_OUT

DO, DIO

NVCC_3V3

i.MX8M and Bluetooth-Module

186

BT_PCM_CLK

DO, DIO

NVCC_3V3

i.MX8M and Bluetooth-Module

188

BT_PCM_SYNC

DO, DIO

NVCC_3V3

i.MX8M and Bluetooth-Module

190

SD2_CMD

DO, DIO

NVCC_3V3

i.MX8M

192

SD2_DATA0

DIO

NVCC_3V3

i.MX8M

194

I2C2_SDA

DIO

NVCC_3V3

i.MX8M

196

I2C2_SCL

DIO

NVCC_3V3

i.MX8M

198

VSYS

PI

+3V3/+5V

200

VCC_SNVS

PI

+3V3 (Must be applied first)

 
2 Interfaces

This chapter includes a short description of all interfaces of the Trizeps VIII Plus.
Please consult the processor datasheet for detailed information.

2.1      Power Supply

The Trizeps VIII Plus can be supplied by a single +3V3/+5V power-supply.
But it is possible to supply parts of the modules separately.

Name

Description

+3V3_SNVS

+3V3 power input. This supply powers the Kinetis MCU. The Kinetis
MCU controls reset and power to the i.MX8M processor and may be programmed by customers.

VSYS

Main power input.

+3V3_AUX (NVCC_3V3)

+3V3 output.
NVCC_3V3 is the IO-voltage for several peripherals of the i.MX8M Plus.
State of GPIO-pins is undefined until +3V3_AUX is available!

AUDIO_VDD

+3V3 power input for audio.
Also used as reference-voltage for ADC of Kinetis MCU.

AUDIO_VDD_SPEAKER

+3V3 or +5V power input for audio speaker.

AUDIO_AGND

Analog GND.

VDD_ENET_IO

+2V5 power output. Ethernet signal IO voltage.

VDD_FPGA_MIPI

+2V5 power output. Voltage is programmable and supplies
the MIPI IO-banks of the FPGA.

VSD_3V3

SD signal IO voltage powerout. ON/OFF Switchable

 

2.2      Control-Signals

Name

Description

RESET_IN

Negated reset input. 0: reset device, 1: normal operation.

RESET_OUT

Negated reset output. 0: device in reset, 1: normal operation.

SPIN24_CTS3

Is connected to the programmable Kinetis MCU.
i.e. may be used to control ONOFF or BOOT_MODE-pin of i.MX8M.

 

2.3      UART

The i.MX8M provides 4 Universal Asynchronous Receiver/Transmitter. With a transceiver these signals can be converted to RS232, RS485 or IrDA.
The SODIMM200 standard defines 3 UART ports, but all 4 UARTs are accessible through the SODIMM200 connector if needed.

Name

Description

UART1_TXD

UART1 transmit output

UART1_RXD

UART1 receive input

UART1_RTS

UART1 request to send output

UART1_CTS

UART1 clear to send input

UART1_DTR

UART1 data terminal ready output;
A GPIO is used to emulate this function.

UART1_DSR

UART1 data set ready input;
A GPIO is used to emulate this function.

UART1_DCD

UART1 data carrier detect input;
A GPIO is used to emulate this function.

UART1_RI

UART1 ring indicator input;
A GPIO is used to emulate this function.

UART2_TXD

UART2 transmit output

UART2_RXD

UART2 receive input

UART2_RTS

UART2 request to send output.
This pin can be configured to be UART4_RXD.

UART2_CTS

UART2 clear to send input.
This pin can be configured to be UART4_TXD.

UART3_TXD

UART3 transmit output;
This signal is routed through the FPGA.
If Trizeps module is without FPGA, there is a mounting option to either route UART3 to the SODIMM or to the bluetooth-module. 

UART3_RXD

UART3 receive input;
This signal is routed through the FPGA.
If Trizeps module is without FPGA, there is a mounting option to either route UART3 to the SODIMM or to the bluetooth-module.

SPIN22_RTS3

UART3 request to send output;
This signal is routed through the FPGA.
If Trizeps module is without FPGA, there is a mounting option to either route UART3 to the SODIMM or to the bluetooth-module.
The SODIMM200-standard does not specify a RTS-pin for UART3.

SPIN24_CTS3

UART3 clear to send input;
This signal is routed through the FPGA.
If Trizeps module is without FPGA, there is a mounting option to either route UART3 to the SODIMM or to the bluetooth-module.
The SODIMM200-standard does not specify a CTS-pin for UART3.

UART1_DSR

UART1 data set ready input;
A GPIO is used to emulate this function.

 Baudrate:             High-speed TIA/EIA-232-F compatible, up to 1Mbit/s
                            IrDA-compatible, up to 115.2 Kbit/s
Data-Bits:             7 or 8 bits (RS232) or 9 bit (RS485)
Stop-Bits:             1, 2
Parity:                   None, Even, Odd
Features:              Hardware-flow-control (RTS,CTS)

2.4      SPI

The serial peripheral interface is a programmable synchronous serial port, which may be used to connect to a multiple of different peripherals.
The i.MX8M features an Enhanced Configurable SPI (ECSPI).
The ECSPI2 is routed to the Kinetis MCU and to the FPGA.
The FPGA allows to route these signals to pins, that carried the SPI pins on previous Trizeps SODIMM200 modules. If no FPGA is mounted, there is a mounting option to route these signals to FPGA_CIF_VSYNC, FPGA_CIF_HSYNC, FPGA_CIF_MCLK and FPGA_CIF_PCLK.

Name

Description

SPI2_SS0

SPI2 Slave Select

SPI2_SCLK

SPI2 Clock

SPI2_MISO

SPI2 Master In Slave Out

SPI2_MOSI

SPI2 Master Out Slave I

Speed: up to 52Mbit/s
Features:         Master & Slave mode

 

2.5      QSPI

The Quad Serial Peripheral Interface (QuadSPI) is a synchronous serial port with up to four bidirectional data lines to interface with external serial flash devices.
This interface is not part of the SODIMM200 standard.

Name

Description

QSPI_SS0

Quad SPI Slave Select

QSPI_SCLK

Quad SPI Clock

QSPI_DATA0

Quad SPI Data0

QSPI_DATA1

Quad SPI Data1

QSPI_DATA2

Quad SPI Data2

QSPI_DATA3

Quad SPI Data3

Speed: up to 50MHz
Features:         Master only.

2.6      I2C

The Inter-Integrated Circuit (I2C) provides functionality of a standard I2C master and slave.

Name

Description

I2C2_SCL

Primary I2C; Clock

I2C2_SDA

Primary I2C; Data

I2C1_SCL

Secondary I2C; Clock

I2C1_SDA

Secondary I2C; Data

Speed: Standard mode, up to 100 kbit/s
                       Fast mode, up to 400 kbit/s
Features:        Multimaster operation.
                       I2C Bus Specification Version 2.1

 

2.7      I2S

The Inter-IC sound interface provides a synchronous audio interface (SAI) and is used to connect to audio codecs.
This interface is not part of the SODIMM200 standard.

Name

Description

SAI1_TXC

Transmit Bit Clock

SAI1_TXFS

Transmit Frame Sync

SAI1_TXD0

Serial transmit data channel 0

SAI1_TXD1

Serial transmit data channel 1

SAI1_TXD2

Serial transmit data channel 2

SAI1_TXD3

Serial transmit data channel 3

SAI1_TXD4

Serial transmit data channel 4

SAI1_TXD5

Serial transmit data channel 5

SAI1_TXD6

Serial transmit data channel 6

SAI1_TXD7

Serial transmit data channel 7

SAI1_RXC

Receive Bit Clock

SAI1_RXFS

Receive Frame Sync

SAI1_MCLK

Audio Master Clock

SAI1_RXD0

Serial receive data channel 0

SAI1_RXD1

Serial receive data channel 1

SAI1_RXD2

Serial receive data channel 2

SAI1_RXD3

Serial receive data channel 3

SAI1_RXD4

Serial receive data channel 4

SAI1_RXD5

Serial receive data channel 5

SAI1_RXD6

Serial receive data channel 6

SAI1_RXD7

Serial receive data channel 7

BT_PCM_CLK

Bluetooth PCM clock (SAI3_RXC)
Optional connected to bluetooth module.

BT_PCM_SYNC

Bluetooth PCM Sync (SAI3_RXFS)
Optional connected to bluetooth module.

BT_PCM_IN

Bluetooth PCM In (SAI3_TXD)
Optional connected to bluetooth module.

BT_PCM_OUT

Bluetooth PCM Out (SAI3_RXD)
Optional connected to bluetooth module.

 

2.8      SD-Card

The SD-Card Interface may be used to connect a SD-Card, eMMC or SDIO-hardware to the Trizeps module.

Name

Description

SD2_CMD

SD-card command output

SD2_CLK

SD-card clock output

SD2_DAT0

SD-card data bit 0

SD2_DAT1

SD-card data bit 1

SD2_DAT2

SD-card data bit 2

SD2_DAT3

SD-card data bit 3

SD2_DET

SD-card detect: 1: card inserted, 0: card removed

Speed: Card bus clock frequency up to 208 MHz
Features:        Conforms to the SD Host Controller Standard Specification version 3.0
Compatible with the MMC System Specification version 4.2/4.3/4.4/4.41/5.0
Compatible with the SD Memory Card Specification version 3.0 and supports the Extended
Capacity SD Memory Card
Compatible with the SDIO Card Specification version 3.0

 

2.9      USB

The Trizeps VIII Plus got two super-speed USB 3.0 ports (1 x OTG, 1 x Host).

Name

Description

USB1_DP

USB1 Data Plus

USB1_DN

USB1 Data Negative

USB1_RX_P

USB1 Receive Data Plus

USB1_RX_N

USB1 RecieveData Negative

USB1_TX_P

USB1 Transmit Data Plus

USB1_TX_N

USB1 Transmit Data Negative

USB1_PEN

USB1 Power Enable output

USB1_OC

USB1 Overcurrent Detect input

USB1_VBUS

USB1 VBUS (+5V)

USB1_ID

USB1 ID Detect

USB2_DP

USB2 Data Plus

USB2_DN

USB2 Data Negative

USB2_RX_P

USB2 Receive Data Plus

USB2_RX_N

USB2 RecieveData Negative

USB2_TX_P

USB2 Transmit Data Plus

USB2_TX_N

USB2 Transmit Data Negative

USB2_PEN

USB2 Power Enable output

USB2_OC

USB2 Overcurrent Detect input

Speed: Super-speed   4 Gbit/s
High-speed      480 Mbit/s
Full-speed       12 Mbit/s
Low-speed      1.5 Mbit/s
Features:     Complies with USB specification rev 3.0 (xHCI compatible)

 

2.10   PCIe

The i.MX8M Plus features one PCI Express dual mode (DM) controller.
The PCIe port is connected to the internal Wireless module.
On modules without Wireless the signals are available on the SODIMM200 connector.

Name

Description

PCIE_REFCLK_N

PCIE Clock (negative)

PCIE_REFCLK_P

PCIE Clock (positive)

PCIE_TXN_N

PCIE Transmit Data (negative)

PCIE_TXN_P

PCIE Transmit Data (positive)

PCIE_RXN_N

PCIE Receive Data (negative)

PCIE_RXN_P

PCIE Receive Data (positive)

PCIE_WAKE

 

PCIE_CLKREQ

 

Speed: 1.5 / 2.5 / 3.0 / 5.0 / 6.0 Gbps
Features:         PCIe specification Gen2 x1 lane
                       PCI Express 1.1/2.0 standard
                       PCI Express Base Specification, Revision 4.0, Version 0.7
                       PIPE Specification for PCI Express, Version 4.3
                       PCI Local Bus Specification, Revision 3.0
                       PCI Bus Power Management Specification, Revision 1.2

2.11   Ethernet

The Trizeps VIII Plus uses an Realtek RTL8211 integrated 10/100/1000 Mbps Ethernet Transceiver to interface with the i.MX8M Plus RGMII.

Name

Description

ETH_TRX0_N

Ethernet0 Transmit/Receive Data 0 (negative)

ETH_TRX0_P

Ethernet0 Transmit/Receive Data 0 (positive)

ETH_TRX1_N

Ethernet0 Transmit/Receive Data 1 (negative)

ETH_TRX1_P

Ethernet0 Transmit/Receive Data 1 (positive)

ETH_TRX2_N

Ethernet0 Transmit/Receive Data 2 (negative)

ETH_TRX2_P

Ethernet0 Transmit/Receive Data 2 (positive)

ETH_TRX3_N

Ethernet0 Transmit/Receive Data 3 (negative)

ETH_TRX3_P

Ethernet0 Transmit/Receive Data 3 (positive)

ETH_LED_LINK_AKT

LED output for 10/100/1000 BASE-T activity

ETH_LED_SPEED100

LED output for 10 / 100 BASE-T link

ETH_LED_SPEED1000

LED output for 1000 BASE-T link

VDD_ENET_IO

+2V5 IO-voltage output.

 An additional 10/100/1000 Mbps Ethernet interface is accessible via RGMII signals, routed directly to the SODIMM200.

Name

Description

ENET1_TX_CTL

Ethernet1 Transmit Control

ENET1_TXC

Ethernet1 Transmit Clock

ENET1_TD0

Ethernet1 Transmit Data 0

ENET1_TD1

Ethernet1 Transmit Data 1

ENET1_TD2

Ethernet1 Transmit Data 2

ENET1_TD3

Ethernet1 Transmit Data 3

ENET1_RX_CTL

Ethernet1 Receive Control

ENET1_RXC

Ethernet1 Receive Clock

ENET1_RD0

Ethernet1 Receive Data 0

ENET1_RD1

Ethernet1 Receive Data 1

ENET1_RD2

Ethernet1 Receive Data 2

ENET1_RD3

Ethernet1 Receive Data 3

 

2.12   CAN

The CAN interface of The Trizeps VIII Plus supports 2 x CAN FD.

Name

Description

CAN1_RX

CAN1 Receive Data

CAN1_TX

CAN1 Transmit Data

CAN2_RX

CAN2 Receive Data

CAN2_TX

CAN2 Transmit Data

 

2.13   Display

The i.MX8M processor has this display interfaces:

  • DSI-MIPI (4ch)

  • Dual Channel LVDS

The DSI-MIPI interface can be converted to parallel RGB Display ( through on board FPGA)

Name

Description

DISPLAY_ENABLE

This GPIO is typical used to control the display-enable
signal of an attached display.

BACKLIGHT_PWM

This GPIO is capable of generating a PWM and is typical
used to generate the backlight PWM signal.

 2.13.1   DSI-MIPI (4ch)

The DSI-MIPI signals are routed to an FPGA and to the B2B-connector.

Name

Description

MIPI_DSI_CLK_P

DSI Clock (positive)

MIPI_DSI_CLK_N

DSI Clock (negative)

MIPI_DSI_D0_P

DSI Data 0 (positive)

MIPI_DSI_D0_N

DSI Data 0 (negative)

MIPI_DSI_D1_P

DSI Data 1 (positive)

MIPI_DSI_D1_N

DSI Data 1 (negative)

MIPI_DSI_D2_P

DSI Data 2( positive)

MIPI_DSI_D2_N

DSI Data 2( negative)

MIPI_DSI_D3_P

DSI Data 3( positive)

MIPI_DSI_D3_N

DSI Data 3( negative)

Speed: Support 80Mbps – 1.5Gbps data rate in high speed operation
                        Support 10Mbps data rate in low power operation.
Features:         Compliant to MIPI-DSI standard v1.2

 

2.13.2  Single-/Dual LVDS

The Trizeps VIII Plus supports Single- and Dual-LVDS up to FullHD (1080p)

Name

Description

LVDS0_CLK_P

Channel A LVDS Clock (positive)

LVDS0_CLK_N

Channel A LVDS Clock (negative)

LVDS0_TX0_P

Channel A LVDS Data 0 (positive)

LVDS0_TX0_N

Channel A LVDS Data 0 (negative)

LVDS0_TX1_P

Channel A LVDS Data 1 (positive)

LVDS0_TX1_N

Channel A LVDS Data 1 (negative)

LVDS0_TX2_P

Channel A LVDS Data 2 (positive)

LVDS0_TX2_N

Channel A LVDS Data 2 (negative)

LVDS0_TX3_P

Channel A LVDS Data 3 (positive)

LVDS0_TX3_N

Channel A LVDS Data 3 (negative)

LVDS1_CLK_P

Channel B LVDS Clock (positive)

LVDS1_CLK_N

Channel B LVDS Clock (negative)

LVDS1_TX0_P

Channel B LVDS Data 0 (positive)

LVDS1_TX0_N

Channel B LVDS Data 0 (negative)

LVDS1_TX1_P

Channel B LVDS Data 1 (positive)

LVDS1_TX2_P

Channel B LVDS Data 2 (positive)

LVDS1_TX2_N

Channel B LVDS Data 2 (negative)

LVDS1_TX3_P

Channel B LVDS Data 3 (positive)

LVDS1_TX3_N

Channel B LVDS Data 3 (negative)

 

2.13.3  Parallel RGB Display

The Trizeps VIII Plus can be equipped with a Lattice MachXO3 FPGA with up to 4300LUT. This FPGA may be programmed to convert the MIPI-DSI data stream into parallel display output. Although this allows flexible pinning, it is recommended to follow the Trizeps SODIMM200 standard.

Name

Description

FPGA_LCD_PCLK

Pixel-Clock

FPGA_LCD_DE

Data-Enable / Data-Valid

FPGA_LCD_HSYNC

Horizontal Sync

FPGA_LCD_VSYNC

Vertical Sync

FPGA_LCD_D00

blue [0]

FPGA_LCD_D01

blue [1]

FPGA_LCD_D02

blue [2]

FPGA_LCD_D03

blue [3]

FPGA_LCD_D04

blue [4]

FPGA_LCD_D05

24bpp: blue [5]

18bpp: blue [5]

16bpp: green [0]

FPGA_LCD_D06

24bpp: blue [6]

18bpp: green [0]

16bpp: green [1]

FPGA_LCD_D07

24bpp: blue [7]

18bpp: green [1]

16bpp: green [2]

FPGA_LCD_D08

24bpp: green [0]

18bpp: green [2]

16bpp: green [3]

FPGA_LCD_D09

24bpp: green [1]

18bpp: green [3]

16bpp: green [4]

FPGA_LCD_D10

24bpp: green [2]

18bpp: green [4]

16bpp: green [5]

FPGA_LCD_D11

24bpp: green [3]

18bpp: green [5]

16bpp: red [0]

FPGA_LCD_D12

24bpp: green [4]

18bpp: red [0]

16bpp: red [1]

FPGA_LCD_D13

24bpp: green [5]

18bpp: red [1]

16bpp: red [2]

FPGA_LCD_D14

24bpp: green [6]

18bpp: red [2]

16bpp: red [3]

FPGA_LCD_D15

24bpp: green [7]

18bpp: red [3]

16bpp: red [4]

FPGA_LCD_D16

24bpp: red [0]

18bpp: red [4]

 

FPGA_LCD_D17

24bpp: red [1]

18bpp: red [5]

 

FPGA_LCD_D18

24bpp: red [2]

 

 

FPGA_LCD_D19

24bpp: red [3]

 

 

FPGA_LCD_D20

24bpp: red [4]

 

 

FPGA_LCD_D21

24bpp: red [5]

 

 

FPGA_LCD_D22

24bpp: red [6]

 

 

FPGA_LCD_D23

24bpp: red [7]

 

 

 

1.13.4  HDMI

The HDMI signals are routed to the B2B-connector and the SODIMM.

Name

Description

HDMI_CLKP

HDMI Clock (positive)

HDMI_CLKN

HDMI Clock (negative)

HDMI_TX0P

HDMI Data 0 (positive)

HDMI_TX0N

HDMI Data 0 (negative)

HDMI_TX1P

HDMI Data 1 (positive)

HDMI_TX1N

HDMI Data 1 (negative)

HDMI_TX2P

HDMI Data 2( positive)

HDMI_TX2N

HDMI Data 2( negative)

HDMI_DDC_SCL

HDMI Control Interface Clock

HDMI_DDC_SDA

HDMI Control Interface Data

HDMI_HPD

HDMI Hot Plug Detection

HDMI_CEC

HDMI Consumer Electronics Control

 

2.14   Camera

The i.MX8M Plus Processor got two MIPI CSI camera interfaces.
They are connected to the B2B-connector.

Name

Description

MIPI_CSI1_CLK_N

First camera clock input – negative

MIPI_CSI1_CLK_P

First camera clock input – positive

MIPI_CSI1_D0_N

First camera data lane 0 – negative

MIPI_CSI1_D0_P

First camera data lane 0 – positive

MIPI_CSI1_D1_N

First camera data lane 1 – negative

MIPI_CSI1_D1_P

First camera data lane 1 – positive

MIPI_CSI1_D2_N

First camera data lane 2 – negative

MIPI_CSI1_D2_P

First camera data lane 2 – positive

MIPI_CSI1_D3_N

First camera data lane 3 – negative

MIPI_CSI1_D3_P

First camera data lane 3 – positive

MIPI_CSI2_CLK_N

Second camera clock input – negative

MIPI_CSI2_CLK_P

Second camera clock input – positive

MIPI_CSI2_D0_N

Second camera data lane 0 – negative

MIPI_CSI2_D1_N

Second camera data lane 1 – negative

MIPI_CSI2_D1_P

Second camera data lane 1 – positive

MIPI_CSI2_D2_N

Second camera data lane 2 – negative

MIPI_CSI2_D2_P

Second camera data lane 2 – positive

MIPI_CSI2_D3_N

Second camera data lane 3 – negative

MIPI_CSI2_D3_P

Second camera data lane 3 – positive

Speed: Support 80Mbps – 1.5Gbps data rate in high speed operation
                        Support 10Mbps data rate in low power operation.
Features:         up to 4-lane; 1.5 Gbps per lane,
Support up to 1080p@60fps video capture.

  

Name

Description

CSI1_PWDN

This GPIO is typical used to control the Power-Down pin of a camera.

CSI_RESET

This GPIO is typical used to control the Reset-pin of a camera.

 

2.15   Wireless

The Trizeps VIII Plus may be equipped with a HD Wireless SPB228, Silex SX-PCEAC2 or AzureWave CM276NF module.
The antennas are connected directly to the module.

Name

Description

BT_LED

Bluetooth active LED

 

2.16   Audio

The Trizeps VIII Plus uses a WM8962 audio-codec. (Other codec-options available on request)

Name

Description

AUDIO_MIC_OUT

Main mic input

AUDIO_MIC_GND

Microphone ground

AUDIO_LINEIN_L

LineIn left channel input

AUDIO_LINEIN_R

LineIn right channel input

AUDIO_HEADPHONE_L

Headphone left channel output

AUDIO_HEADPHONE_R

Headphone right channel output

AUDIO_HEADPHONE_GND

Headphone ground sensing input

SPEAKER_P

Class-D speaker amp + output

SPEAKER_N

Class-D speaker amp – output

AUDIO_ENABLE

This GPIO is typical used to control the enable pin of an external audio-amplifier connected to the AUDIO_HEADPHONE pins.

 

2.17   SPDIF

The i.MX8M Plus supplies a Sony/Philips Digital Interface (SPDIF) stereo transceiver that allows the processor to receive and transmit digital audio.

Name

Description

SPDIF_IN

SPDIF input

SPDIF_OUT

SPDIF output

SPDIF_EXT_CLK

SPDIF clock

 

2.18   Secure Element

The Trizeps VIII Plus supports a built-in Secure Element solution consisting of a NXP SE050 which is connected to I2C3.

3      Specifications

3.1      Absolute Maximum Ratings

Absolute maximum ratings reflect conditions that the module may be exposed outside of the operating limits, without experiencing immediate functional failure. Functional operation is only expected during the conditions indicated under “Recommended Operating Conditions”. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the module. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

 

Pin

Min

 

Max

Unit

Supply Voltage

+3V3_SNVS
VSYS
AUDIO_VDD
AVDD_SPEAKER

-0.3
-0.3
-0.3
-0.3

 

3.8
5.5
4.5
7.0

V
V
V
V

Storage Temperature

TStorage

-40

 

+85

°C

 

3.2      Recommended Operating Conditions

 

Pin

Min

Typ

Max

Unit

Supply Voltage

+3V3_SNVS
VSYS
AUDIO_VDD
AVDD_SPEAKER

3.1
3.1
2.8
2.8

3.3
3.3
3.3
3.3

3.4
5.0
3.4
5.0

V
V
V
V

Supply current (typ.)
Power consumption dramatically depends on the usage scenario.
This includes things like if the processors operating point (frequency) can be set to a lower level; if the GPU can be used by an application; the selected display-resolution or if the module supplies external peripherals i.e. a speaker or if the PMIC charges a battery.

 We recommend to use a 2A voltage-regulator to supply the module.

   @ 3.3V
   Idle
   Using/Running

  Typ. Peak Currents    when running.

416 

757

 1.151

 

 

456.5
824


 522

 923

 

 

mA
mA
mA

A

Operating temperature
The chip temperature of processor or LPDDR4 might get hotter. The max. case temperature of i.MX 8M Plus is specified with +95°C (consumer) and +105°C (industrial).
A higher refresh-rate-setting is needed when case temperature of LPDDR4 is expected to rise above +85°C.
Temperature of eMMC influence the achievable Data Retention.

TConsumer
TExtended
TIndustrial

0
-25
-40

+25
+25
+25

+85
+85
+85

°C
°C
°C

 

3.3      ESD Ratings

 

 

Max

Unit

V(ESD) Electrostatic
discharge

Human body model (HBM)
Charged-device model (CDM)

±1000
±250

V
V

 

3.4      Electrical Characteristics

3.4.1  i.MX 8M Plus GPIO DC parameters. Please view i.MX 8M Plus datasheet for details:

 

Parameter

Min

Max

Unit

VIL_3V3

Low-level input voltage

-0.3

0.3 x VDD

V

VIH_3V3

High-level input voltage

      0.7 x VDD

VDD + 0.3

V

VOH_3V3

High-level output voltage

      0.8 x VDD

VDD

V

VOH_3V3

Low-level output voltage

0

0.2 x VDD

V

RP_up

Pull-Up Resistance (1)

18

72

kΩ

RP_down

Pull-Down Resistance (1)

24

87

kΩ

  • The i.MX 8M Plus does not support internal pull-up/down for VDD=3.3V.

  • The state of the GPIO-pins is undefined until the PMIC has powered-up and +3V3_AUX is supplied.

 

3.4.2  FPGA single-Ended DC parameters. Please view FPGA datasheet for details:

 

Parameter

Min

Max

Unit

VIL_3V3

Low-level input voltage

-0.3

0.8

V

VIH_3V3

High-level input voltage

2.0

3.6

V

VOH_3V3

High-level output voltage

VSYS–0.2 (IOH=-100µA)
VSYS-0.4 (IOH=-16mA)

-

V

VOH_3V3

Low-level output voltage

            -

0.2 (IOL=100µA)
0.4 (IOL=16mA)

V

IPU

Pull-Up Current

           -30

-309

µA

IPD

Pull-Down Current

           30

305

µA

 

3.4.3  Cortex M0+ MCU DC parameters. Please view MCU datasheet for details:

 

Parameter

Min

Max

Unit

VIL_3V3

Low-level input voltage

-

0.35 x VCC_SNVS

V

VIH_3V3

High-level input voltage

  0.7 x VCC_SNVS

-

V

VOH_3V3

High-level output voltage

VSYS–0.5 (IOH=-5mA)
VSYS-0.5 (IOH=-18mA)

-

V

VOH_3V3

Low-level output voltage

            -

0.5 (IOL=5mA)
0.5 (IOL=18mA)

V

IOHT

Output high current total for all ports

            -

100

mA

IOLT

Output low current total for all ports

 -

100

mA

RPU

Internal pullup resistor

           20

50

kΩ

 

3.5      Mechanical Specification

Dimensions (mm) of the Trizeps VIII Plus module (top view)

Dimensions (mm) of the Trizeps VIII Plus module (bottom view)

4      Article numbers for Trizeps VIII Plus

Part number structure

Examples article numbers

Article number 00…

Trizeps VIII Plus

66B21.E0912.
H00S00

Trizeps VIII Plus EC/
Quad/IT1600/R2G/EMMC8G/ ETH/COD/RoHS
(Extended Consumer Temperature -25 to 85°C, i.MX 8M Plus Quad Core, IT 1.6 GHz,
2 GB RAM, 8 GB eMMC, Ethernet, Codec)

66A21.C2B32.
H00S00

Trizeps VIII Plus CT/Quad/
C01800/R2G/EMMC8G/FPGA/ ETH/COD/MCU/WB/RoHS
(Consumer Temperature 0 to 70°C, i.MX 8M Plus Quad Core, C0 1.8 GHz, 2 GB RAM,
8 GB eMMC, FPGA LF21,  Ethernet, Codec, Kinetis MCU, WLAN, Bluetooth)

 Other versions on request

5     Important Notice

 

6     Document History

Rev.

Date

Author

Changes

0.9

08.03.2022

JP

Initial version

0.9.1

24.05.2022

VoB

Chapter 4.0 adjusted

0.9.2

08.06.2022

JP

Minor changes

1.0

21.11.2022

MP

Update new CI

 

 

 

 

 

 

 

 

Baseboard & Panels

The Trizeps VIII Plus fits into following Seco products:

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