Micromodule

In 2015 Seco created a new SOM standard with Myon I, which is powered by a 64-bit Qualcomm Snapdragon Quad-Core Arm processor.
Compared to our SODIMM200 standard, its focus is to allow to build more compact and smaller devices.
Like with our previous standards, we will continue to build new modules which are kept compatible, so that our customers can easily migrate to new technologies and features in future without or only little modifications to their design.

Excel Sheet containing pinning of current Myon modules and baseboards: myon_standard_v5.zip

 Myon II Family Comparison

 

Myon II Nano
i.MX 8M Nano

Myon II
i.MX 8M Mini

 

Myon II Nano
i.MX 8M Nano

Myon II
i.MX 8M Mini

Main CPU

4x Arm Cortex A53
1.6GHz

4x Arm Cortex A53
1.8GHz

MCU/DSP

Cortex-M7 650MHz

Cortex-M4 400MHz

GDR

16bit LPDDR4

32bit LPDDR4

GPU

GC7000UL (2 shaders),
OpenGL® ES
2.0/3.0/3.1, Vulkan®,
OpenCL™ 1.2

GC NanoUltra (1 shader),
OpenGL ES 2.0;
GC520L (2D)

Security

CAAM, RDC, Arm TrustZone®

CAAM, RDC, TrustZone

AI/ML

OpenCL CPU, GPU: 32GOPS

OpenCL CPU: 32GOPS

Cam

MIPI CSI (4 lanes)

MIPI CSI (4 lanes)

screen

MIPI DSI (4-lanes)
DSI→LVDS

MIPI DSI (4-lanes)
DSI→LVDS

video decode

-

1080p60 HEVC, H.264,
VP9, ​​VP8

Video Encode

-

1080p60 H.264, VP8

Expansion I/O

1x USB 2.0 with PHY

2x USB 2.0 with PHY,
1x PCIe® Gen2

Network,
Storage

1x GbE, 2x SDIO/eMMC

1x GbE, 2x SDIO/eMMC