Micromodule

In 2015 Seco created a new SOM standard with Myon I, which is powered by a 64-bit Qualcomm Snapdragon Quad-Core Arm processor.
Compared to our SODIMM200 standard, its focus is to allow to build more compact and smaller devices.
Like with our previous standards, we will continue to build new modules which are kept compatible, so that our customers can easily migrate to new technologies and features in future without or only little modifications to their design.

Excel Sheet containing pinning of current Myon modules and baseboards: myon_standard_v5.zip

Myon II Family Comparison

	Myon II Nano i.MX 8M Nano	Myon II i.MX 8M Mini

	Myon II Nano i.MX 8M Nano	Myon II i.MX 8M Mini
Main CPU	4x Arm Cortex A53 1.6GHz	4x Arm Cortex A53 1.8GHz
MCU/DSP	Cortex-M7 650MHz	Cortex-M4 400MHz
GDR	16bit LPDDR4	32bit LPDDR4
GPU	GC7000UL (2 shaders), OpenGL® ES 2.0/3.0/3.1, Vulkan®, OpenCL™ 1.2	GC NanoUltra (1 shader), OpenGL ES 2.0; GC520L (2D)
Security	CAAM, RDC, Arm TrustZone®	CAAM, RDC, TrustZone
AI/ML	OpenCL CPU, GPU: 32GOPS	OpenCL CPU: 32GOPS
Cam	MIPI CSI (4 lanes)	MIPI CSI (4 lanes)
screen	MIPI DSI (4-lanes) DSI→LVDS	MIPI DSI (4-lanes) DSI→LVDS
video decode	-	1080p60 HEVC, H.264, VP9, VP8
Video Encode	-	1080p60 H.264, VP8
Expansion I/O	1x USB 2.0 with PHY	2x USB 2.0 with PHY, 1x PCIe® Gen2
Network, Storage	1x GbE, 2x SDIO/eMMC	1x GbE, 2x SDIO/eMMC